A thorough treatment of energy harvesting technologies, highlighting radio frequency (RF) and hybrid-multiple technology harvesting. The authors explain the principles of solar, thermal, kinetic, and electromagnetic energy harvesting, address design challenges, and describe applications. The volume features an introduction to switched mode power converters and energy storage and summarizes the challenges of different system implementations, from wireless transceivers to backscatter communication systems and ambient backscattering. This practical resource is essential for researchers and graduate students in the field of communications and sensor technology, in addition to practitioners working in these fields.

System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.

This book is for RF Engineers and, in particular, those engineers focusing mostly on RF systems and RFIC design. The author develops systematic methods for RF systems design, complete with a comprehensive set of design formulas. Its focus on mobile station transmitter and receiver system design also applies to transceiver design of other wireless systems such as WLAN. This comprehensive reference work covers a wide range of topics from general principles of communication theory, as it applies to digital radio designs to specific examples on implementing multimode mobile systems.

Modeling, Simulation, Design and Engineering of WDM Systems and Networks provides readers with the basic skills, concepts, and design techniques used to begin design and engineering of optical communication systems and networks at various layers. The latest semi-analytical system simulation techniques are applied to optical WDM systems and networks, and a review of the various current areas of optical communications is presented. Simulation is mixed with experimental verification and engineering to present the industry as well as state-of-the-art research. This contributed volume is divided into three parts, accommodating different readers interested in various types of networks and applications. The first part of the book presents modeling approaches and simulation tools mainly for the physical layer including transmission effects, devices, subsystems, and systems), whereas the second part features more engineering/design issues for various types of optical systems including ULH, access, and in-building systems. The third part of the book covers networking issues related to the design of provisioning and survivability algorithms for impairment-aware and multi-domain networks. Intended for professional scientists, company engineers, and university researchers, the text demonstrates the effectiveness of computer-aided design when it comes to network engineering and prototyping.

The 2nd Edition of Optical Wireless Communications: System and Channel Modelling with MATLAB® with additional new materials, is a self-contained volume that provides a concise and comprehensive coverage of the theory and technology of optical wireless communication systems (OWC). The delivery method makes the book appropriate for students studying at undergraduate and graduate levels as well as researchers and professional engineers working in the field of OWC. The book gives a detailed description of OWC, focusing mainly on the infrared and visible bands, for indoor and outdoor applications. A major attraction of the book is the inclusion of Matlab codes and simulations results as well as experimental test-beds for free space optics and visible light communication systems. This valuable resource will aid the readers in understanding the concept, carrying out extensive analysis, simulations, implementation and evaluation of OWC links. This 2nd edition is structured into nine compact chapters that cover the main aspects of OWC systems: History, current state of the art and challenges Fundamental principles Optical source and detector and noise sources Modulation, equalization, diversity techniques Channel models and system performance analysis Visible light communications Terrestrial free space optics communications Relay-based free space optics communications Matlab codes. A number of Matlab based simulation codes are included in this 2nd edition to assist the readers in mastering the subject and most importantly to encourage them to write their own simulation codes and enhance their knowledge.

This volume comprises the proceedings of the International Conference on Recent Cognizance in Wireless Communication & Image Processing. It brings together content from academicians, researchers, and industry experts in areas of Wireless Communication and Image Processing. The volume provides a snapshot of current progress in computational creativity and a glimpse of future possibilities. The proceedings include two kinds of paper submissions: (i) regular papers addressing foundation issues, describing original research on creative systems development and modeling; and (ii) position papers describing work-in-progress or research directions for computational creativity. This work will be useful to professionals and researchers working in the core areas of wireless communications and image processing.

A fully updated, comprehensive guide to electronic packaging technologies This thoroughly revised resource offers rigorous and complete coverage of microsystems packaging at both the device and system level. You will get in-depth guidance on the latest technologies from academic and industry leaders. New chapters cover topics highly relevant to today's small and ultra-small systems. Fundamentals of Microsystems Packaging, Second Edition, discusses the entire field, from wafer to systems, and clearly explains every major contributing technology. The book details emerging systems, including smart wearables, the Internet of Things, bioelectronics for medical applications, cloud computing, and much more. Microelectronics, photonics, MEMS, sensors, RF, and wireless technologies are fully covered. • Covers the electrical, mechanical, chemical, and materials aspects of each technology • Contains examples of all common configurations and technologies • Written by the leading author in the field