In the Information Age, society has become accustomed to continuous, rapid advances in electronics technology. As the power density of these devices increases, heat dissipation threatens to become the limiting factor for growth in the electronics industry. In order to sustain rapid growth, the development of advanced thermal management strategies to efficiently dissipate heat from electronics is imperative. Porous wicks are of great interest in thermal management because they are capable of passively supplying liquid for thin film evaporation, a promising method to reliably dissipate heat in high-performance electronics. While the maximum heat flux that can be reliably sustained (the dryout heat flux) has been well-characterized for many wick configurations, key design information is missing as many previous models cannot determine the distribution of evaporator surface temperature nor temperature at the evaporator's interface with electronic components. Temperature gradients are inherent to the passive capillary pumping mechanism since the shape of the liquid-vapor interface is a function of the local liquid pressure, causing spatial variation of permeability and the heat transfer coefficient (HTC). Accounting for the variation of the liquid-vapor interface to determine the resulting temperature gradients has been a significant modeling challenge. In this thesis, we present a comprehensive modeling framework for thin film evaporation in micropillar wicks that can predict dryout heat flux and local temperature simultaneously. Our numerical approach captures the effect of varying interfacial curvature across the micropillar evaporator to determine the spatial distributions of temperature and heat flux. Heat transfer and capillary flow in the wick are coupled in a computationally efficient manner via incorporation of parametric studies to relate geometry and interface shape to local permeability and HTC. While most previous models only consider uniform thermal loads, our model offers the flexibility to consider arbitrary (non-uniform) thermal loads, making it suitable to guide the design of porous wick evaporators for cooling realistic electronic devices. We present case studies from our model that underscore its capability to guide design with respect to temperature and dryout heat flux. This model predicts notable variations of the HTC (-30%) across the micropillar wick, highlighting the significant effects of interfacial curvature that have not been considered previously. We demonstrate the model's capability to simulate non-uniform thermal loads and show that wick configuration with respect to the input thermal distribution has a significant effect on performance due to the distribution of the HTC and capillary pressure. Further, we are able to quantify the tradeoff associated with enhancing either dryout heat flux or the HTC by optimizing geometry. We offer insights into optimization and further analyze the effects of micropillar geometry on the HTC. Finally, we integrate this model into a fast, compact thermal model (CTM) to make it suitable for thermal/electronics codesign of high-performance devices and demonstrate a thermal simulation of a realistic microprocessor using this CTM. We discuss further uses of our model and describe an experimental platform that could validate our predicted temperature distributions. Lastly, we propose a biporous, area-enhanced wick structure that could push thermal performance to new limits by overcoming the design challenge typically associated with porous wick evaporators.

This Handbook provides researchers, faculty, design engineers in industrial R&D, and practicing engineers in the field concise treatments of advanced and more-recently established topics in thermal science and engineering, with an important emphasis on micro- and nanosystems, not covered in earlier references on applied thermal science, heat transfer or relevant aspects of mechanical/chemical engineering. Major sections address new developments in heat transfer, transport phenomena, single- and multiphase flows with energy transfer, thermal-bioengineering, thermal radiation, combined mode heat transfer, coupled heat and mass transfer, and energy systems. Energy transport at the macro-scale and micro/nano-scales is also included. The internationally recognized team of authors adopt a consistent and systematic approach and writing style, including ample cross reference among topics, offering readers a user-friendly knowledgebase greater than the sum of its parts, perfect for frequent consultation. The Handbook of Thermal Science and Engineering is ideal for academic and professional readers in the traditional and emerging areas of mechanical engineering, chemical engineering, aerospace engineering, bioengineering, electronics fabrication, energy, and manufacturing concerned with the influence thermal phenomena.

Heat Pipes, Sixth Edition, takes a highly practical approach to the design and selection of heat pipes, making it an essential guide for practicing engineers and an ideal text for postgraduate students.This new edition has been revised to include new information on the underlying theory of heat pipes and heat transfer, and features fully updated applications, new data sections, and updated chapters on design and electronics cooling. The book is a useful reference for those with experience and an accessible introduction for those approaching the topic for the first time. - Contains all information required to design and manufacture a heat pipe - Suitable for use as a professional reference and graduate text - Revised with greater coverage of key electronic cooling applications

Presents basic and advanced techniques in the analytical and numerical modeling of various heat pipe systems under a variety of operating conditions and limitations. It describes the variety of complex and coupled processes of heat and mass transfer in heat pipes. The book consists of fourteen chapters, two appendices, and over 400 illustrations, along with numerous references and a wide variety of technical data on heat pipes.

Provides a comprehensive coverage of the basic phenomena. It contains twenty-five chapters which cover different aspects of boiling and condensation. First the specific topic or phenomenon is described, followed by a brief survey of previous work, a phenomenological model based on current understanding, and finally a set of recommended design equa

This self-contained book is an up-to-date description of the basic theory of molecular gas dynamics and its various applications. The book, unique in the literature, presents working knowledge, theory, techniques, and typical phenomena in rarefied gases for theoretical development and application. Basic theory is developed in a systematic way and presented in a form easily applied for practical use. In this work, the ghost effect and non-Navier–Stokes effects are demonstrated for typical examples—Bénard and Taylor–Couette problems—in the context of a new framework. A new type of ghost effect is also discussed.

This textbook presents a modern treatment of fundamentals of heat and mass transfer in the context of all types of multiphase flows with possibility of phase-changes among solid, liquid and vapor. It serves equally as a textbook for undergraduate senior and graduate students in a wide variety of engineering disciplines including mechanical engineering, chemical engineering, material science and engineering, nuclear engineering, biomedical engineering, and environmental engineering. Multiphase Heat Transfer and Flow can also be used to teach contemporary and novel applications of heat and mass transfer. Concepts are reinforced with numerous examples and end-of-chapter problems. A solutions manual and PowerPoint presentation are available to instructors. While the book is designed for students, it is also very useful for practicing engineers working in technical areas related to both macro- and micro-scale systems that emphasize multiphase, multicomponent, and non-conventional geometries with coupled heat and mass transfer and phase change, with the possibility of full numerical simulation.