Chiplet Design and Heterogeneous Integration Packaging
Title | Chiplet Design and Heterogeneous Integration Packaging PDF eBook |
Author | John H. Lau |
Publisher | Springer Nature |
Pages | 542 |
Release | 2023-03-27 |
Genre | Technology & Engineering |
ISBN | 9811999171 |
The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Semiconductor Advanced Packaging
Title | Semiconductor Advanced Packaging PDF eBook |
Author | John H. Lau |
Publisher | Springer Nature |
Pages | 513 |
Release | 2021-05-17 |
Genre | Technology & Engineering |
ISBN | 9811613761 |
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Title | Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology PDF eBook |
Author | John H. Lau |
Publisher | Springer Nature |
Pages | 515 |
Release | |
Genre | |
ISBN | 9819721407 |
Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach
Title | Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach PDF eBook |
Author | Farhang Yazdani |
Publisher | Springer |
Pages | 182 |
Release | 2018-03-12 |
Genre | Technology & Engineering |
ISBN | 3319757695 |
This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author’s extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level.
Heterogeneous Integrations
Title | Heterogeneous Integrations PDF eBook |
Author | John H. Lau |
Publisher | Springer |
Pages | 368 |
Release | 2019-04-03 |
Genre | Technology & Engineering |
ISBN | 9811372241 |
Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.
Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces
Title | Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces PDF eBook |
Author | Beth Keser |
Publisher | John Wiley & Sons |
Pages | 324 |
Release | 2021-12-29 |
Genre | Technology & Engineering |
ISBN | 1119793777 |
Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches. The book begins with a market analysis of the latest technology trends in Fan-Out and Wafer Level Packaging before moving on to a cost analysis of these solutions. The contributors discuss the new package types for advanced application spaces being created by companies like TSMC, Deca Technologies, and ASE Group. Finally, emerging technologies from academia are explored. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces is an indispensable resource for microelectronic package engineers, managers, and decision makers working with OEMs and IDMs. It is also a must-read for professors and graduate students working in microelectronics packaging research.
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Title | Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology PDF eBook |
Author | John H. Lau |
Publisher | Springer |
Pages | 0 |
Release | 2024-08-18 |
Genre | Technology & Engineering |
ISBN | 9789819721399 |
This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as wafer bumping, flip chip assembly, underfill and reliability, chip-to-wafer, wafer-to-wafer, Cu-Cu hybrid bonding, WLCSP, 6-side molded WLCSP, FOWLP such as hybrid substrates with PID, ABF, and ultra-large organic interposer, the communications between chiplets and heterogeneous integration packaging, and on-board optics, near-package optics, and co-packaged optics. The book benefits researchers, engineers, and graduate students in the fields of electrical engineering, mechanical engineering, materials sciences, industry engineering, etc.