Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.

Ceramic fuel cells, commonly known as solid oxide fuel cells (SOFCs), have been under development for a broad range of electric power generation applications. The most attractive feature of the SOFC is its clean and efficient production of electricity from a variety of fuels. The SOFC has the potential to be manufactured and operated cost-effectively. The widening interest in this technology, thus, arises from the continuing need to develop cleaner and more efficient means of converting energy sources into useful forms.This topical book provides a comprehensive treatise on solid oxide fuel cells and succeeds successfully in filling the gap in the market for a reference book in this field. Directed towards scientists, engineers, and technical managers working with SOFCs as well as ceramic devices based on conducting materials, and in related fields, the book will also be invaluable as a textbook for science and engineering courses.

This book joins and integrates ceramics and ceramic-based materials in various sectors of technology. A major imperative is to extract scientific information on joining and integration response of real, as well as model, material systems currently in a developmental stage. This book envisions integration in its broadest sense as a fundamental enabling technology at multiple length scales that span the macro, millimeter, micrometer and nanometer ranges. Consequently, the book addresses integration issues in such diverse areas as space power and propulsion, thermoelectric power generation, solar energy, micro-electro-mechanical systems (MEMS), solid oxide fuel cells (SOFC), multi-chip modules, prosthetic devices, and implanted biosensors and stimulators. The engineering challenge of designing and manufacturing complex structural, functional, and smart components and devices for the above applications from smaller, geometrically simpler units requires innovative development of new integration technology and skillful adaptation of existing technology.

Bridging the gap between textbook science and real-world engineering and operational applications, this reference presents comprehensive and easy-to-follow summaries and evaluations of fabrication techniques for ceramic and ceramic composite specimens and components. The author addresses both conventional and alternative powder-based fabrication, chemical vapor deposition, melt processing, and reaction processing. Topics include the preparation of ceramic powders, plastic forming, colloidal processing, the use of additives to aid densification, hot pressing, the fabrication of filaments for reinforcement, rapid prototyping, and gaseous impurities.