The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.

Packed with precise, step-by-step checklists, detailed illustrations, and informative chapter explanations, the Electrical Inspection Manual, 2011 Edition identifies important Code rules and provides guidance on how-to organize checklists by occupancy type to increase thoroughness and decrease the likelihood of overlooking potential problems. Written by certified electrical inspectors, and endorsed by the National Fire Protection Association (NFPA) and the International Association of Electrical Inspectors (IAEI), this fully illustrated manual explains significant tasks, defines terms, outlines key questions, and provides a concise overview of the electrical inspection process.