Development of 3D silicon radiation sensors employing electrodes fabricated perpendicular to the sensor surfaces to improve fabrication yields and increasing pulse speeds.

Written by the leading names in this field, this book introduces the technical properties, design and fabrication details, measurement results, and applications of three-dimensional silicon radiation sensors. Such devices are currently used in the ATLAS experiment at the European Centre for Particle Physics (CERN) for particle tracking in high energy physics. These sensors are the radiation hardest devices ever fabricated and have applications in ground-breaking research in neutron detection, medical dosimetry and space technologies and more. Chapters explore the essential features of silicon particle detectors, interactions of radiation with matter, radiation damage effects, and micro-fabrication, in addition to a providing historical overview of the field. This book will be a key reference for students and researchers working with sensor technologies. Features: The first book dedicated to this unique and growing subject area, which is also widely applicable in high-energy physics, medical physics, space science and beyond Authored by Sherwood Parker, the inventor of the concept of 3D detectors; Cinzia Da Vià, who has brought 3DSi technology to application; and Gian-Franco Dalla Betta, a leading figure in the design and fabrication technology of these devices Explains to non-experts the essential features of silicon particle detectors, interactions of radiation with matter, radiation damage effects, and micro-fabrication

Silicon sensors with a three-dimensional (3-D) architecture, in which the n and p electrodes penetrate through the entire substrate, have many advantages over planar silicon sensors including radiation hardness, fast time response, active edge and dual readout capabilities. The fabrication of 3D sensors is however rather complex. In recent years, there have been worldwide activities on 3D fabrication. SINTEF in collaboration with Stanford Nanofabrication Facility have successfully fabricated the original (single sided double column type) 3D detectors in two prototype runs and the third run is now on-going. This paper reports the status of this fabrication work and the resulted yield. The work of other groups such as the development of double sided 3D detectors is also briefly reported.

Presents a comprehensive and interdisciplinary review of the major cutting-edge technology research areas—especially those on new materials and methods as well as advanced structures and properties—for various sensor and detection devices The development of sensors and detectors at macroscopic or nanometric scale is the driving force stimulating research in sensing materials and technology for accurate detection in solid, liquid, or gas phases; contact or non-contact configurations; or multiple sensing. The emphasis on reduced-scale detection techniques requires the use of new materials and methods. These techniques offer appealing perspectives given by spin crossover organic, inorganic, and composite materials that could be unique for sensor fabrication. The influence of the length, composition, and conformation structure of materials on their properties, and the possibility of adjusting sensing properties by doping or adding the side-groups, are indicative of the starting point of multifarious sensing. The role of intermolecular interactions, polymer and ordered phase formation, as well as behavior under pressure and magnetic and electric fields are also important facts for processing ultra-sensing materials. The 15 chapters written by senior researchers in Advanced Sensor and Detection Materials cover all these subjects and key features under three foci: 1) principals and perspectives, 2) new materials and methods, and 3) advanced structures and properties for various sensor devices.

This book begins by introducing new and unique fabrication, micromachining, and integration manufacturing methods for MEMS (Micro-Electro-Mechanical Systems) and NEMS (Nano-Electro-Mechanical Systems) devices, as well as novel nanomaterials for sensor fabrications. The second section focuses on novel sensors based on these emerging MEMS/NEMS fabrication methods, and their related applications in industrial, biomedical, and environmental monitoring fields, which makes up the sensing layer (or perception layer) in IoT architecture. This authoritative guide offers graduate students, postgraduates, researchers, and practicing engineers with state-of-the-art processes and cutting-edge technologies on MEMS /NEMS, micro- and nanomachining, and microsensors, addressing progress in the field and prospects for future development. Presents latest international research on MEMS/NEMS fabrication technologies and novel micro/nano sensors; Covers a broad spectrum of sensor applications; Written by leading experts in the field.