Since conventional cooling techniques are increasing falling short of meeting the ever-growing cooling demands of high heat generating devices, thermal systems, and processes, advanced and innovative cooling technologies are of immense importance to deal with such high thermal management. Hence, this book covers a number of key topics related to advanced cooling approaches, their performance, and applications, including: Evaporative air cooling; Spray impingement cooling; Heat pump-based cooling; Modular cooling for photovoltaic plant; Nucleate pool boiling of refrigerants; Transient flashing spray cooling and application; Compressor cooling systems for industry. The book is aimed at a wide variety of people from graduate students and researchers to manufacturers who are involved or interested in the areas of thermal management systems, cooling technologies, and their applications.

Advances in Solar Heating and Cooling presents new information on the growing concerns about climate change, the security of energy supplies, and the ongoing interest in replacing fossil fuels with renewable energy sources. The amount of energy used for heating and cooling is very significant, estimated, for example, as half of final energy consumption in Europe. Solar thermal installations have the potential to meet a large proportion of the heating and cooling needs of both buildings and industry and the number of solar thermal installations is increasing rapidly. This book provides an authoritative review of the latest research in solar heating and cooling technologies and applications. - Provides researchers in academia and industry with an authoritative overview of heating and cooling for buildings and industry in one convenient volume - Part III, 'Solar cooling technologies' is contributed by authors from Shanghai Jiao Tong University, which is a world-leader in this area - Covers advanced applications from zero-energy buildings, through industrial process heat to district heating and cooling

This book, based on the research experience and outcomes of a group of international contributors, addresses a range of advanced energy efficiency technologies and their applications in solar heating, cooling and power generation, while also providing solutions for tackling recurring low efficiency problems in today's systems. It highlights the latest technologies and methods, which can significantly improve the performance of solar systems, enabling readers to design, construct and apply high-performance solar systems in or for their own projects. The contributors provide a systematic introduction to state-of-the-art energy efficiency technologies that demonstrates how to implement innovative solar systems. These technologies include: " heat pipes and loop heat pipes; " phase change materials (PCMs) and PCM slurries; " micro-channel panels; " desiccant/adsorption cycling; " ejector cooling and heat pumps; and " solar concentration and thermoelectric units. The book shows how innovative solar systems applicable to rural and urban buildings can be analysed and demonstrates the successful implementation of these advanced technologies. It delivers the design principles and associated energy performance assessment methods for a range of selected solar heating, cooling and power generation projects. This book offers a valuable source of information for final-year undergraduate students, as well as graduate students and academic lecturers, as it promotes the widespread deployment of advanced solar heating, cooling and power generation technologies applicable for buildings across the globe. The book is also a good point of reference for design engineers and energy consultants who wish to extend their knowledge of advanced technologies used to achieve energy efficiency.

Heat pipes are efficient passive devices that can transfer large amounts of heat over long distances with small temperature differences between the heat sources and sinks by evaporation and condensation of the working fluid. Heat can be transferred without the use of any mechanically moving parts such as pumps and active controls in heat pipes. The vapor and liquid circulate in the conventional heat pipes, including thermosiphons, via evaporation/condensation and capillary or gravitational forces. For pulsating heat pipes, liquid slug and vapor plugs in the capillary tube oscillate due to evaporation and condensation. The effective thermal conductivity of a heat pipe can be three orders of magnitude higher than that of a copper rod with the same size. A heat pipe can find its applications in many sectors of industries, including electronics cooling, energy systems, spacecraft thermal control, permafrost cooling, and manufacturing. This book presents current research and development related to the design, applications and technology of various heat pipes, including conventional heat pipes and thermosyphon, pulsating heat pipes, loop heat pipes, and variable conductance heat pipes. Design tools based on computational fluid dynamics simulation and HSHPTM (Heat Sink-Heat Pipe Thermal Module) software are also presented.

A comprehensive reference for engineers and researchers, Gas Turbine Heat Transfer and Cooling Technology, Second Edition has been completely revised and updated to reflect advances in the field made during the past ten years. The second edition retains the format that made the first edition so popular and adds new information mainly based on selected published papers in the open literature. See What’s New in the Second Edition: State-of-the-art cooling technologies such as advanced turbine blade film cooling and internal cooling Modern experimental methods for gas turbine heat transfer and cooling research Advanced computational models for gas turbine heat transfer and cooling performance predictions Suggestions for future research in this critical technology The book discusses the need for turbine cooling, gas turbine heat-transfer problems, and cooling methodology and covers turbine rotor and stator heat-transfer issues, including endwall and blade tip regions under engine conditions, as well as under simulated engine conditions. It then examines turbine rotor and stator blade film cooling and discusses the unsteady high free-stream turbulence effect on simulated cascade airfoils. From here, the book explores impingement cooling, rib-turbulent cooling, pin-fin cooling, and compound and new cooling techniques. It also highlights the effect of rotation on rotor coolant passage heat transfer. Coverage of experimental methods includes heat-transfer and mass-transfer techniques, liquid crystal thermography, optical techniques, as well as flow and thermal measurement techniques. The book concludes with discussions of governing equations and turbulence models and their applications for predicting turbine blade heat transfer and film cooling, and turbine blade internal cooling.

The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.