The second edition of this industrial guide contains descriptions of some 2,500 adhesive, sealants, and coatings, based on information provided by manufacturers and distributors of these products. The volume is divided into 11 sections based on end use: adhesives--general; adhesives--cyanocrylate; adhesives--epoxy; caulks and sealants; coatings; conductive compounds; encapsulating, potting, casting, impregnating compounds; films and tapes; insulating products; silicones; and miscellaneous. Each product lists, as available, company name and product category; tradename and product number; and product description/specification. Typical end uses may also be included. Includes a list of suppliers' addresses. Annotation copyrighted by Book News, Inc., Portland, OR

Handbook of Adhesives and Sealants is the most comprehensive Adhesives and Sealants Handbook ever published, with the cooperation of around 35 authors from all over the world – each one a specialist in their field. It will include 80 chapters dealing with general information, theory of bonding and sealing, design of bonding parts, technical characteristics, chemistry, types of adhesives, application, equipment, controls, standards etc. Industrial applications such as automotive, aeronautics, building and civil engineering, electronics, packaging, wood, furniture, metals, plastics and composites, textiles, footwear etc. - Over 1,000 real-life examples illustrate the do's and don'ts of using adhesives - Every scientific and technical issue concerning every chemical type in every industry - Designed to help solve problems quickly, the content is structured to allow readers to navigate this comprehensive resource in 4 different ways

The second edition of this popular industrial guide describes over 2,800 currently available epoxy resins, curing agents, compounds, and modifiers, based on information supplied by 71 manufacturers or distributors of these products. Epoxy resins have experienced tremendous growth since their introduction in the 1950s. Future growth will be in new markets in the specialty performance areas and high-technology applications. Each raw material or product is described, as available, with typical assay or checkpoint figures and a brief summary of important features or applications. Additional sections useful to the reader are the Suppliers' Addresses and a Trade Name Index.

The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.

New technologies constantly generate new demands for exotic materials to be used in severe environments. The rapid developments of aerospace industries during the last two decades have required new materials to survive extreme high and low temperatures and various radiations. The exploration of new energy sources, e.g., solar and geothermal, has led us to develop new solar collectors and geothermal devices. Even the search for new oils has demanded that we study the corrosive environment of oil fields. In the telecommunication industries, optical fibers have been adopted broadly to replace metallic conductors. However, none of the optical fibers can survive abrasion or corrosion without the application of a coating material. For microelectronics, protection in terms of coatings and encapsulants is deemed necessary to prevent corrosion. One of the major causes of corrosion has been shown to be water which appears to be abundant in our earthly environments. Water can attack the bulk adhesive (or sealant), the interface, or the adherend. Water can also cause delamination of coating film, and it is definitely the major ingredient in causing cathodic or anodic corrosion. Thus, water becomes the major obstacle in solving durability problems of various materials in harsh environments.