The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.

The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.

The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.

Advances in Nonvolatile Memory and Storage Technology, Second Edition, addresses recent developments in the non-volatile memory spectrum, from fundamental understanding, to technological aspects. The book provides up-to-date information on the current memory technologies as related by leading experts in both academia and industry. To reflect the rapidly changing field, many new chapters have been included to feature the latest in RRAM technology, STT-RAM, memristors and more. The new edition describes the emerging technologies including oxide-based ferroelectric memories, MRAM technologies, and 3D memory. Finally, to further widen the discussion on the applications space, neuromorphic computing aspects have been included. This book is a key resource for postgraduate students and academic researchers in physics, materials science and electrical engineering. In addition, it will be a valuable tool for research and development managers concerned with electronics, semiconductors, nanotechnology, solid-state memories, magnetic materials, organic materials and portable electronic devices. - Discusses emerging devices and research trends, such as neuromorphic computing and oxide-based ferroelectric memories - Provides an overview on developing nonvolatile memory and storage technologies and explores their strengths and weaknesses - Examines improvements to flash technology, charge trapping and resistive random access memory

The 2nd volume of 'Advances in Microelectronics: Reviews' Book Series is written by 57 contributors from academy and industry from 11 countries (Bulgaria, Hungary, Iran, Japan, Malaysia, Romania, Russia, Slovak Republic, Spain, Ukraine and USA). The book contains 13 chapters from different areas of microelectronics: MEMS, materials characterization, and various microelectronic devices. With unique combination of information in each volume, the Book Series will be of value for scientists and engineers in industry and at universities. Each of chapter is ending by well selected list of references with books, journals, conference proceedings and web sites. This book ensures that readers will stay at the cutting edge of the field and get the right and effective start point and road map for the further researches and developments.

Flexible Electronic Packaging and Encapsulation Technology A systematic introduction to the future of electronic packaging Electronic packaging materials are among the most important components of the broader electronics industry, capable of facilitating heat dissipation, redistributing stress on electronic components, and providing environmental protections for electronic systems. Recent advances in integrated circuits, especially the development of flexible electronic technology, have placed increasingly stringent demands on the capabilities of electronic packaging. These technologies have the potential to reshape our world, and they demand a generation of engineers capable of harnessing that potential. Flexible Electronic Packaging and Encapsulation Technology meets this demand with an introduction to the cutting-edge technologies available to package electronic components, as well as the testing methods and applications that bring these technologies to bear on the industry. These packaging technologies promise to bring lightness, flexibility, and environmental friendliness to the next generation of electronic systems. Flexible Electronic Packaging and Encapsulation Technology readers will also find: Survey of commercial electronic packaging materials and patents for reference purposes Guidelines for designing high-performance packaging materials with novel structures An authorial team of leading researchers in the field Flexible Electronic Packaging and Encapsulation Technology is ideal for materials scientists, electronics engineers, solid state physicists, professionals in the semiconductor industry, and any other researchers or professionals working with electronic systems.