The ISSE conference series is a renowned European forum for exchanging knowledge between senior and young scientists from academic communities and electronic industries from around the world on topics related to their experimental and theoretical work in the very wide spread field of electronics and micro nanoelectronics technology and in particular electronics packaging technology The motto of the upcoming conference event is Advancements in Microelectronics Packaging for Harsh Environment In the frame of a unique combination of poster exhibitions, oral paper presentations, and individual meetings senior and junior researchers from all over the world come together to discuss scientific problems and their teaching experiences as well as plan and organize international research co operations and student exchanges in a convenient and multicultural atmosphere

This book gathers the latest advances, innovations, and applications in the field of sensing technology, as presented by international researchers and engineers at the 15th International Conference on Sensing Technology (ICST), held in Sydney, Australia on December 5–7, 2022. Contributions include a wide range of topics such as: vision sensing, sensor signal processing, sensors phenomena and modelling, sensor characterization, smart sensors and sensor fusion, electromagnetic, chemical and physical sensors, electronic nose technology, biosensors, nano sensors, wireless sensors and WSN, Internet of Things, optical sensors, sensor arrays, intelligent sensing, Internet-based and remote data acquisition. The contributions, which were selected by means of a rigorous international peer-review process, present a wealth of exciting ideas that will open novel research directions and foster multidisciplinary collaboration among different specialists.

This book provides selected papers presented at the 2nd International Conference on Industrial Applications of Adhesives 2022, held in Carvoeiro, Portugal, 3-4 March 2022. The volume focuses on applications of adhesive bonding in the industry such as automotive, aeronautic, railway, marine, energy, and electronics. A wide range of topics like adhesion assessment between polymers and metals, pressure sensitive adhesives, adhesive bonding process optimization, civil applications, adhesive joints in composite materials and elastic adhesives are covered. The book presents the latest results and innovations in this field, useful for adhesive producers and adhesive users.

This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials’ development, encompassing composite solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.