This book showcases the state of the art in the field of sensors and microsystems, revealing the impressive potential of novel methodologies and technologies. It covers a broad range of aspects, including: bio-, physical and chemical sensors, actuators, micro- and nano-structured materials, mechanisms of interaction and signal transduction, polymers and biomaterials, sensor electronics and instrumentation, analytical microsystems, recognition systems and signal analysis and sensor networks as well as manufacturing technologies, environmental, food, energy and biomedical applications. The contents reflect the outcomes of the activities of AISEM (Italian Association of Sensors and Microsystems) in 2021. Co-Edited by B. Andò, F. Baldini, G. Betta, D. Compagnone, S. Conoci, E. Comini, V. Ferrari, E. La Salandra, L. Lorenzelli, A.G. Mignani, G. Marrazza, G. Neri, P. Siciliano.

Given the exponential growth seen in the flexible, printed and disposable sensor technology, the development of novel printable and solution processable nanomaterials, and the development of novel printing techniques that have brought about a new wave of novel printed sensor technologies and applications, the IEEE FLEPS offers an excellent forum to discuss latest developments in the field as well as understand the future roadmap

This book provides readers with an introduction to the materials and devices necessary for flexible sensors and electronics, followed by common techniques for fabrication of such devices and system-level integration. Key insights into fabrication and processing will guide readers through the tradeoff choices in designing such platforms. A comprehensive review of two specific, flexible bioelectronic platforms, related to smart bandages for wound monitoring and thread-based diagnostics for wearable health, will demonstrate practical application at the system level. The book also provides a unique electrical engineering perspective by reviewing circuit architectures for low noise signal conditioning of weak signals from sensors,, and for low power analog to digital converters for signal acquisition. To achieve energy autonomy, authors provide several example of CMOS energy harvesting front end circuits and voltage boosters. Beyond circuit architectures, the book also provides a review of the modern theory of sampling and recovery of sparse signals, also known as compressed sensing. They then highlight how these principles can be leveraged for design and implementation of efficient signal acquisition hardware and reliable processing of acquired data for flexible electronic platforms.

Advances in Semiconductor Technologies Discover the broad sweep of semiconductor technologies in this uniquely curated resource Semiconductor technologies and innovations have been the backbone of numerous different fields: electronics, online commerce, the information and communication industry, and the defense industry. For over fifty years, silicon technology and CMOS scaling have been the central focus and primary driver of innovation in the semiconductor industry. Traditional CMOS scaling has approached some fundamental limits, and as a result, the pace of scientific research and discovery for novel semiconductor technologies is increasing with a focus on novel materials, devices, designs, architectures, and computer paradigms. In particular, new computing paradigms and systems—such as quantum computing, artificial intelligence, and Internet of Things—have the potential to unlock unprecedented power and application space. Advances in Semiconductor Technologies provides a comprehensive overview of selected semiconductor technologies and the most up-to-date research topics, looking in particular at mainstream developments in current industry research and development, from emerging materials and devices, to new computing paradigms and applications. This full-coverage volume gives the reader valuable insights into state-of-the-art advances currently being fabricated, a wide range of novel applications currently under investigation, and a glance into the future with emerging technologies in development. Advances in Semiconductor Technologies readers will also find: A comprehensive approach that ensures a thorough understanding of state-of-the-art technologies currently being fabricated Treatments on all aspects of semiconductor technologies, including materials, devices, manufacturing, modeling, design, architecture, and applications Articles written by an impressive team of international academics and industry insiders that provide unique insights into a wide range of topics Advances in Semiconductor Technologies is a useful, time-saving reference for electrical engineers working in industry and research, who are looking to stay abreast of rapidly advancing developments in semiconductor electronics, as well as academics in the field and government policy advisors.

This book reports on the design, fabrication and characterization of a set of flexible electronic components, including on-foil sensors, organic thin-film transistors and ultra-thin chips. The core of the work is on showing how to combine high-performance integrated circuits with large-area electronic components on a single polymeric foil, to realize smart electronic systems for different applications, such as temperature, humidity and mechanical stress sensors. The book offers an extensive introduction to Hybrid System-in-Foil technology (HySiF), and related on-chip/on-foil passive and active components. It presents six case studies designed to highlight key HySiF challenges, together with the methodology to address those challenges. Last but not least, it describes the development of a reconfigurable, energy-efficient Analog-to-Digital Converter for HySiF. All in all, this book provides readers with extensive information on the state of the art in the design and characterization of integrated circuits and hybrid electronic systems on flexible polymeric substrates. By describing significant advances in organic thin-film transistor technology, this work is expected to pave the way to future developments in the area of energy-efficient smart sensors and integrated circuits.

This book presents select proceedings of the International Conference on Micro and Nanoelectronics Devices, Circuits and Systems (MNDCS-2022). The book includes cutting-edge research papers in the emerging fields of micro and nanoelectronics devices, circuits, and systems from experts working in these fields over the last decade. The book is a unique collection of chapters from different areas with a common theme and is immensely useful to academic researchers and practitioners in the industry who work in this field.

Hybrid Systems-in-Foil (HySiF) is a concept that extends the potential of conventional More-than-More Systems-in/on-Package (SiPs and SoPs) to the flexible electronics world. In HySiF, an economical implementation of flexible electronic systems is possible by integrating a minimum number of embedded silicon chips and a maximum number of on-foil components. Here, the complementary characteristics of CMOS SoCs and larger area organic and printed electronics are combined in a HySiF-compatible polymeric substrate. Within the HySiF scope, the fabrication process steps and the integration design rules with all the accompanying boundary conditions concerning material compatibility, surface properties, and thermal budget, are defined. This Element serves as an introduction to the HySiF concept. A summary of recent ultra-thin chip fabrication and flexible packaging techniques is provided. Several bendable electronic components are presented demonstrating the benefits of HySiF. Finally, prototypes of flexible wireless sensor systems that adopt the HySiF concept are demonstrated.