Semiconductor thermal management and modeling

This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.

This book presents articles from the International Conference on Modelling, Simulation and Intelligent Computing (MoSICom 2020), held at Birla Institute of Technology and Science Pilani, Dubai Campus, Dubai, UAE, in January 2020. Modelling and simulation are becoming increasingly important in a wide variety of fields, from Signal, Image and Speech Processing, and Microelectronic Devices and Circuits to Intelligent Techniques, Control and Energy Systems, and Power Electronics. Further, Intelligent Computational techniques are gaining significance in interdisciplinary engineering applications, such as Robotics and Automation, Healthcare Technologies, IoT and its Applications. Featuring the latest advances in the field of engineering applications, this book serves as a definitive reference resource for researchers, professors and practitioners interested in exploring advanced techniques in the field of modelling, simulation and computing.

The theories describing seemingly unrelated areas of physics have surprising analogies that have aroused the curiosity of scientists and motivated efforts to identify reasons for their existence. Comparative study of physical theories has revealed the presence of a common topological and geometric structure. The Mathematical Structure of Classical and Relativistic Physics is the first book to analyze this structure in depth, thereby exposing the relationship between (a) global physical variables and (b) space and time elements such as points, lines, surfaces, instants, and intervals. Combining this relationship with the inner and outer orientation of space and time allows one to construct a classification diagram for variables, equations, and other theoretical characteristics. The book is divided into three parts. The first introduces the framework for the above-mentioned classification, methodically developing a geometric and topological formulation applicable to all physical laws and properties; the second applies this formulation to a detailed study of particle dynamics, electromagnetism, deformable solids, fluid dynamics, heat conduction, and gravitation. The third part further analyses the general structure of the classification diagram for variables and equations of physical theories. Suitable for a diverse audience of physicists, engineers, and mathematicians, The Mathematical Structure of Classical and Relativistic Physics offers a valuable resource for studying the physical world. Written at a level accessible to graduate and advanced undergraduate students in mathematical physics, the book can be used as a research monograph across various areas of physics, engineering and mathematics, and as a supplemental text for a broad range of upper-level scientific coursework.

This book presents selected contributions to the 16th International Conference on Global Research and Education Inter-Academia 2017 hosted by Alexandru Ioan Cuza University of Iași, Romania from 25 to 28 September 2017. It is the third volume in the series, following the editions from 2015 and 2016. Fundamental and applied research in natural sciences have led to crucial developments in the ongoing 4th global industrial revolution, in the course of which information technology has become deeply embedded in industrial management, research and innovation – and just as deeply in education and everyday life. Materials science and nanotechnology, plasma and solid state physics, photonics, electrical and electronic engineering, robotics and metrology, signal processing, e-learning, intelligent and soft computing have long since been central research priorities for the Inter-Academia Community (I-AC) – a body comprising 14 universities and research institutes from Japan and Central/East-European countries that agreed, in 2002, to coordinate their research and education programs so as to better address today’s challenges. The book is intended for use in academic, government, and industrial R&D departments as a reference tool in research and technology education. The 42 peer-reviewed papers were written by more than 119 leading scientists from 14 countries, most of them affiliated to the I-AC.

Thermal Management for LED Applications provides state-of-the-art information on recent developments in thermal management as it relates to LEDs and LED-based systems and their applications. Coverage begins with an overview of the basics of thermal management including thermal design for LEDs, thermal characterization and testing of LEDs, and issues related to failure mechanisms and reliability and performance in harsh environments. Advances and recent developments in thermal management round out the book with discussions on advances in TIMs (thermal interface materials) for LED applications, advances in forced convection cooling of LEDs, and advances in heat sinks for LED assemblies.