2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Title | 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) PDF eBook |
Author | IEEE Staff |
Publisher | |
Pages | |
Release | 2015-06-29 |
Genre | |
ISBN | 9781479999293 |
IPFA 2015 will be devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures and issues related to semiconductor device reliability and yield, especially those related to advanced process technologies, which include Sample Preparation, Metrology and Material Characterization Advanced Failure Analysis Techniques Die Level Package Level Failure Analysis Case Study & Failure Mechanisms Novel CMOS Gate Stack Dielectrics and FEOL Reliability and Failure Mechanisms Product Reliability Evaluation and Approaches Device (Ge, III V, TFT, Memory, MEMS, LED etc ) Reliability and Failure Mechanisms Advanced Interconnects and BEOL Reliability and Failure Mechanism
2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2015)
Title | 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2015) PDF eBook |
Author | |
Publisher | |
Pages | 580 |
Release | 2015 |
Genre | |
ISBN | 9781479999286 |
Proceedings of the 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Title | Proceedings of the 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) PDF eBook |
Author | |
Publisher | |
Pages | |
Release | 2015 |
Genre | Integrated circuits |
ISBN |
ISTFA 2017: Proceedings from the 43rd International Symposium for Testing and Failure Analysis
Title | ISTFA 2017: Proceedings from the 43rd International Symposium for Testing and Failure Analysis PDF eBook |
Author | ASM International |
Publisher | ASM International |
Pages | 666 |
Release | 2017-12-01 |
Genre | Technology & Engineering |
ISBN | 1627081518 |
The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.
ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis
Title | ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis PDF eBook |
Author | |
Publisher | ASM International |
Pages | 540 |
Release | 2019-12-01 |
Genre | Technology & Engineering |
ISBN | 1627082735 |
The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
Harsh Environment Electronics
Title | Harsh Environment Electronics PDF eBook |
Author | Ahmed Sharif |
Publisher | John Wiley & Sons |
Pages | 398 |
Release | 2019-08-05 |
Genre | Technology & Engineering |
ISBN | 3527344195 |
Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines the application of nanomaterials, current trends within the topic area, and the potential environmental impacts of material usage. Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact. -Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics -Reviews all relevant materials used in interconnect technology as well as alternative approaches otherwise neglected in other literature -Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications -Covers wide-bandgap semiconductor device technologies for high temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more -A pivotal reference for professionals, engineers, students, and researchers Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.
Proceedings of the ... International Symposium on the Physical & Failure Analysis of Integrated Circuits
Title | Proceedings of the ... International Symposium on the Physical & Failure Analysis of Integrated Circuits PDF eBook |
Author | |
Publisher | |
Pages | 378 |
Release | 2005 |
Genre | Integrated circuits |
ISBN |