The proceedings from the 2003 IEEE Conference on Electron Devices and Solid-State Circuits.

Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.

The book describes the significant multidisciplinary research findings at the Università Politecnica delle Marche and the expected future advances. It addresses some of the most dramatic challenges posed by today’s fast-growing, global society and the changes it has caused. It also discusses solutions to improve the wellbeing of human beings. The book covers the main research achievements in the different disciplines of the physical sciences and engineering, as well as several research lines developed at the university’s Faculty of Engineering in the fields of electronic and information engineering, telecommunications, biomedical engineering, mechanical engineering, manufacturing technologies, energy, advanced materials, chemistry, physics of matter, mathematical sciences, geotechnical engineering, circular economy, urban planning, construction engineering, infrastructures and environment protection, technologies and digitization of the built environment and cultural heritage. It highlights the international relevance and multidisciplinarity of research at the university as well as the planned research lines for the next years.

This book describes optical receiver solutions integrated in standard CMOS technology, attaining high-speed short-range transmission within cost-effective constraints. These techniques support short reach applications, such as local area networks, fiber-to-the-home and multimedia systems in cars and homes. The authors show how to implement the optical front-end in the same technology as the subsequent digital circuitry, leading to integration of the entire receiver system in the same chip. The presentation focuses on CMOS receiver design targeting gigabit transmission along a low-cost, standardized plastic optical fiber up to 50m in length. This book includes a detailed study of CMOS optical receiver design – from building blocks to the system level.

Digital photography, MP3, digital video, etc. make extensive use of NAND-based Flash cards as storage media. To realize how much NAND Flash memories pervade every aspect of our life, just imagine how our recent habits would change if the NAND memories suddenly disappeared. To take a picture it would be necessary to find a film (as well as a traditional camera...), disks or even magnetic tapes would be used to record a video or to listen a song, and a cellular phone would return to be a simple mean of communication rather than a multimedia console. The development of NAND Flash memories will not be set down on the mere evolution of personal entertainment systems since a new killer application can trigger a further success: the replacement of Hard Disk Drives (HDDs) with Solid State Drives (SSDs). SSD is made up by a microcontroller and several NANDs. As NAND is the technology driver for IC circuits, Flash designers and technologists have to deal with a lot of challenges. Therefore, SSD (system) developers must understand Flash technology in order to exploit its benefits and countermeasure its weaknesses. Inside NAND Flash Memories is a comprehensive guide of the NAND world: from circuits design (analog and digital) to Flash reliability (including radiation effects), from testing issues to high-performance (DDR) interface, from error correction codes to NAND applications like Flash cards and SSDs.

Unfriendly to conventional electronic devices, circuits, and systems, extreme environments represent a serious challenge to designers and mission architects. The first truly comprehensive guide to this specialized field, Extreme Environment Electronics explains the essential aspects of designing and using devices, circuits, and electronic systems intended to operate in extreme environments, including across wide temperature ranges and in radiation-intense scenarios such as space. The Definitive Guide to Extreme Environment Electronics Featuring contributions by some of the world’s foremost experts in extreme environment electronics, the book provides in-depth information on a wide array of topics. It begins by describing the extreme conditions and then delves into a description of suitable semiconductor technologies and the modeling of devices within those technologies. It also discusses reliability issues and failure mechanisms that readers need to be aware of, as well as best practices for the design of these electronics. Continuing beyond just the "paper design" of building blocks, the book rounds out coverage of the design realization process with verification techniques and chapters on electronic packaging for extreme environments. The final set of chapters describes actual chip-level designs for applications in energy and space exploration. Requiring only a basic background in electronics, the book combines theoretical and practical aspects in each self-contained chapter. Appendices supply additional background material. With its broad coverage and depth, and the expertise of the contributing authors, this is an invaluable reference for engineers, scientists, and technical managers, as well as researchers and graduate students. A hands-on resource, it explores what is required to successfully operate electronics in the most demanding conditions.

This work covers the design of CMOS fully integrated low power low phase noise voltage controlled oscillators for telecommunication or datacommuni- tion systems. The need for low power is obvious, as mobile wireless telecommunications are battery operated. As wireless telecommunication systems use oscillators in frequency synthesizers for frequency translation, the selectivity and signal to noise ratio of receivers and transmitters depend heavily on the low phase noise performance of the implemented oscillators. Datacommunication s- tems need low jitter, the time-domain equivalent of low phase noise, clocks for data detection and recovery. The power consumption is less critical. The need for multi-band and multi-mode systems pushes the high-integration of telecommunication systems. This is o?ered by sub-micron CMOS feat- ing digital ?exibility. The recent crisis in telecommunication clearly shows that mobile hand-sets became mass-market high-volume consumer products, where low-cost is of prime importance. This need for low-cost products - livens tremendously research towards CMOS alternatives for the bipolar or BiCMOS solutions in use today.