Wafer Scale Integration (WSI) is the culmination of the quest for larger integrated circuits. In VLSI chips are developed by fabricating a wafer with hundreds of identical circuits, testing the circuits, dicing the wafer, and packaging the good dice. In contrast in WSI, a wafer is fabricated with several types of circuits (generally referred to as cells), with multiple instances of each cell type, the cells are tested, and good cells are interconnected to realize a system on the wafer. Since most signal lines stay on the wafer, stray capacitance is low, so that high speeds are achieved with low power consumption. For the same technology a WSI implementation may be a factor of five faster, dissipate a factor of ten less power, and require one hundredth to one thousandth the volume. Successful development of WSI involves many overlapping disciplines, ranging from architecture to test design to fabrication (including laser linking and cutting, multiple levels of interconnection, and packaging). This book concentrates on the areas that are unique to WSI and that are as a result not well covered by any of the many books on VLSI design. A unique aspect of WSI is that the finished circuits are so large that there will be defects in some portions of the circuit. Accordingly much attention must be devoted to designing architectures that facilitate fault detection and reconfiguration to of WSI include fabrication circumvent the faults. Other unique aspects technology and packaging.

This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.

Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.

Dieses Buch enthält die Beiträge der 4. GI/ITG/GMA-Fachtagung über Fehlertolerierende Rechensysteme, die im September 1989 in einer Reihe von Tagungen in München 1982, Bonn 1984 sowie Bremerhaven 1987 veranstaltet wurde. Die 31 Beiträge, darunter 4 eingeladene, sind teils in deutscher, überwiegend aber in englischer Sprache verfa€t. Insgesamt wird durch diese Beiträge die Entwicklung der Konzeption und Implementierung fehlertoleranter Systeme in den letzten zwei Jahren vor allem in Europa dokumentiert. Sämtliche Beiträge berichten über neue Forschungs- oder Entwicklungsergebnisse.

Computational intelligence is a component of Encyclopedia of Technology, Information, and Systems Management Resources in the global Encyclopedia of Life Support Systems (EOLSS), which is an integrated compendium of twenty one Encyclopedias. Computational intelligence is a rapidly growing research field including a wide variety of problem-solving techniques inspired by nature. Traditionally computational intelligence consists of three major research areas: Neural Networks, Fuzzy Systems, and Evolutionary Computation. Neural networks are mathematical models inspired by brains. Neural networks have massively parallel network structures with many neurons and weighted connections. Whereas each neuron has a simple input-output relation, a neural network with many neurons can realize a highly non-linear complicated mapping. Connection weights between neurons can be adjusted in an automated manner by a learning algorithm to realize a non-linear mapping required in a particular application task. Fuzzy systems are mathematical models proposed to handle inherent fuzziness in natural language. For example, it is very difficult to mathematically define the meaning of “cold” in everyday conversations such as “It is cold today” and “Can I have cold water”. The meaning of “cold” may be different in a different situation. Even in the same situation, a different person may have a different meaning. Fuzzy systems offer a mathematical mechanism to handle inherent fuzziness in natural language. As a result, fuzzy systems have been successfully applied to real-world problems by extracting linguistic knowledge from human experts in the form of fuzzy IF-THEN rules. Evolutionary computation includes various population-based search algorithms inspired by evolution in nature. Those algorithms usually have the following three mechanisms: fitness evaluation to measure the quality of each solution, selection to choose good solutions from the current population, and variation operators to generate offspring from parents. Evolutionary computation has high applicability to a wide range of optimization problems with different characteristics since it does not need any explicit mathematical formulations of objective functions. For example, simulation-based fitness evaluation is often used in evolutionary design. Subjective fitness evaluation by a human user is also often used in evolutionary art and music. These volumes are aimed at the following five major target audiences: University and College students Educators, Professional practitioners, Research personnel and Policy analysts, managers, and decision makers.