This book contains the papers that have been presented at the ninth Very Large Scale Integrated Systems conference VLSI'97 that is organized biannually by IFIP Working Group 10.5. It took place at Hotel Serra Azul, in Gramado Brazil from 26-30 August 1997. Previous conferences have taken place in Edinburgh, Trondheim, Vancouver, Munich, Grenoble and Tokyo. The papers in this book report on all aspects of importance to the design of the current and future integrated systems. The current trend towards the realization of versatile Systems-on-a-Chip require attention of embedded hardware/software systems, dedicated ASIC hardware, sensors and actuators, mixed analog/digital design, video and image processing, low power battery operation and wireless communication. The papers as presented in Jhis book have been organized in two tracks, where one is dealing with VLSI System Design and Applications and the other presents VLSI Design Methods and CAD. The following topics are addressed: VLSI System Design and Applications Track • VLSI for Video and Image Processing. • Microsystem and Mixed-mode design. • Communication And Memory System Design • Cow-voltage & Low-power Analog Circuits. • High Speed Circuit Techniques • Application Specific DSP Architectures. VLSI Design Methods and CAD Track • Specification and Simulation at System Level. • Synthesis and Technology Mapping. • CAD Techniques for Low-Power Design. • Physical Design Issues in Sub-micron Technologies. • Architectural Design and Synthesis. • Testing in Complex Mixed Analog and Digital Systems.

For Electrical Engineering and Computer Engineering courses that cover the design and technology of very large scale integrated (VLSI) circuits and systems. May also be used as a VLSI reference for professional VLSI design engineers, VLSI design managers, and VLSI CAD engineers. Modern VSLI Design provides a comprehensive “bottom-up” guide to the design of VSLI systems, from the physical design of circuits through system architecture with focus on the latest solution for system-on-chip (SOC) design. Because VSLI system designers face a variety of challenges that include high performance, interconnect delays, low power, low cost, and fast design turnaround time, successful designers must understand the entire design process. The Third Edition also provides a much more thorough discussion of hardware description languages, with introduction to both Verilog and VHDL. For that reason, this book presents the entire VSLI design process in a single volume.

Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th

This book is the second of two volumes addressing the design challenges associated with new generations of semiconductor technology. The various chapters are compiled from tutorials presented at workshops in recent years by prominent authors from all over the world. Technology, productivity and quality are the main aspects under consideration to establish the major requirements for the design and test of upcoming systems on a chip.

Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization

Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.

Silicon-on-Insulator Technology: Materials to VLSI, Third Edition, retraces the evolution of SOI materials, devices and circuits over a period of roughly twenty years. Twenty years of progress, research and development during which SOI material fabrication techniques have been born and abandoned, devices have been invented and forgotten, but, most importantly, twenty years during which SOI Technology has little by little proven it could outperform bulk silicon in every possible way. The turn of the century turned out to be a milestone for the semiconductor industry, as high-quality SOI wafers suddenly became available in large quantities. From then on, it took only a few years to witness the use of SOI technology in a wealth of applications ranging from audio amplifiers and wristwatches to 64-bit microprocessors. This book presents a complete and state-of-the-art review of SOI materials, devices and circuits. SOI fabrication and characterization techniques, SOI CMOS processing, and the physics of the SOI MOSFET receive an in-depth analysis. Silicon-on-Insulator Technology: Materials to VLSI, Third Edition, also describes the properties of other SOI devices, such as multiple gate MOSFETs, dynamic threshold devices and power MOSFETs. The advantages and performance of SOI circuits used in both niche and mainstream applications are discussed in detail. The SOI specialist will find this book invaluable as a source of compiled references covering the different aspects of SOI technology. For the non-specialist, the book serves an excellent introduction to the topic with detailed, yet simple and clear explanations. Silicon-on-Insulator Technology: Materials to VLSI, Third Edition is recommended for use as a textbook for classes on semiconductor device processing and physics at the graduate level.