Failure analysis and reliability improvement are linked for improvement of microcircuits packaging by these technical papers. Design factors such as oxide reliability, electromigration and die metallization are considered in testing, and analytic approaches to improved reliability.

This "must have" reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits.

This volume contains the conference proceedings of the 2001 8th International Symposium on the Physical and Failure Analysis of Integrated Circuits.