System-level modeling of MEMS - microelectromechanical systems - comprises integrated approaches to simulate, understand, and optimize the performance of sensors, actuators, and microsystems, taking into account the intricacies of the interplay between mechanical and electrical properties, circuitry, packaging, and design considerations. Thereby, system-level modeling overcomes the limitations inherent to methods that focus only on one of these aspects and do not incorporate their mutual dependencies. The book addresses the two most important approaches of system-level modeling, namely physics-based modeling with lumped elements and mathematical modeling employing model order reduction methods, with an emphasis on combining single device models to entire systems. At a clearly understandable and sufficiently detailed level the readers are made familiar with the physical and mathematical underpinnings of MEMS modeling. This enables them to choose the adequate methods for the respective application needs. This work is an invaluable resource for all materials scientists, electrical engineers, scientists working in the semiconductor and/or sensor industry, physicists, and physical chemists.

Does MEMS technology offer advantages to your company's products? Will miniature machines on a chip solve your application objectives for ôsmaller, better, cheaper, and faster'ö If you are a product development engineer or manager, the decision to design a MEMS device implies having an application and market. This book offers you a practical guide to making this important business decision. Here, both veterans and newcomers to MEMS device design will get advice on evaluating MEMS for their business, followed by guidance on selecting solutions, technologies and design support tools. You will see how experts from around the world have explored MEMS possibilities and achieved new breakthrough devices such as RF-MEMS for mobile telecommunications, micro-optics for internet hardware, catheter-based minimal-invasive operating theatre tools, and in vivo monitoring of exact dosage of medication in ailing patients. This handbook offers a wealth of analytical techniques treating problematic areas such as alternative designs reliability, packaging, and cost effectiveness.

This book highlights numerical models as powerful tools for the optimal design of Micro-Electro-Mechanical Systems (MEMS). Most MEMS experts have a background in electronics, where circuit models or behavioral models (i.e. lumped-parameter models) of devices are preferred to field models. This is certainly convenient in terms of preliminary design, e.g. in the prototyping stage. However, design optimization should also take into account fine-sizing effects on device behavior and therefore be based on distributed-parameter models, such as finite-element models. The book shows how the combination of automated optimal design and field-based models can produce powerful design toolboxes for MEMS. It especially focuses on illustrating theoretical concepts with practical examples, fostering comprehension through a problem-solving approach. By comparing the results obtained using different methods, readers will learn to identify their respective strengths and weaknesses. In addition, special emphasis is given to evolutionary computing and nature-inspired optimization strategies, the effectiveness of which has already been amply demonstrated. Given its scope, the book provides PhD students, researchers and professionals in the area of computer-aided analysis with a comprehensive, yet concise and practice-oriented guide to MEMS design and optimization. To benefit most from the book, readers should have a basic grasp of electromagnetism, vector analysis and numerical methods.

A comprehensive guide to MEMS materials, technologies and manufacturing, examining the state of the art with a particular emphasis on current and future applications. Key topics covered include: - Silicon as MEMS material - Material properties and measurement techniques - Analytical methods used in materials characterization - Modeling in MEMS - Measuring MEMS - Micromachining technologies in MEMS - Encapsulation of MEMS components - Emerging process technologies, including ALD and porous silicon Written by 73 world class MEMS contributors from around the globe, this volume covers materials selection as well as the most important process steps in bulk micromachining, fulfilling the needs of device design engineers and process or development engineers working in manufacturing processes. It also provides a comprehensive reference for the industrial R&D and academic communities. - Veikko Lindroos is Professor of Physical Metallurgy and Materials Science at Helsinki University of Technology, Finland. - Markku Tilli is Senior Vice President of Research at Okmetic, Vantaa, Finland. - Ari Lehto is Professor of Silicon Technology at Helsinki University of Technology, Finland. - Teruaki Motooka is Professor at the Department of Materials Science and Engineering, Kyushu University, Japan. - Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques - Shows how to protect devices from the environment and decrease package size for dramatic reduction of packaging costs - Discusses properties, preparation, and growth of silicon crystals and wafers - Explains the many properties (mechanical, electrostatic, optical, etc), manufacturing, processing, measuring (incl. focused beam techniques), and multiscale modeling methods of MEMS structures

With its unique promise to revolutionize science, engineering, technology, and other fields, nanotechnology continues to profoundly impact associated materials, components, and systems, particularly those used in telecommunications. These developments are leading to easier convergence of related technologies, massive storage data, compact storage devices, and higher-performance computing. Nanotechnology for Telecommunications presents vital technical scientific information to help readers grasp issues and challenges associated with nanoscale telecommunication system development and commercialization—and then avail themselves of the many opportunities to be gleaned. This book provides technical information and research ideas regarding the use of nanotechnology in telecommunications and information processing, reflecting the continuing trend toward the use of optoelectronics. Nanotech will eventually lead to a technology cluster that offers a complete range of functionalities for systems used in domains including information, energy, construction, environmental, and biomedical. Describing current and future developments that hold promise for significant innovations in telecommunications, this book is organized to provide a progressive understanding of topics including: Background information on nanoscience and nanotechnology Specific applications of nanotechnology in telecommunications Nanostructured optoelectronic materials MEMS, NEMS, and their applications in communication systems Quantum dot Cellular Automata (QCA) and its applications in telecommunication systems How nonohmic nonlinear behavior affects both digital and analog signal processing Concepts regarding quantum switching and its applications in quantum networks The scale of the physical systems that use nanoscale electronic devices is still large, and that presents serious challenges to the establishment of interconnections between nanoscale devices and the outside world. Also addressing consequent social implications of nanotech, this book reviews a broad range of the nano concepts and their influence on every aspect of telecommunications. It describes the different levels of interconnections in systems and details the standardized assembly process for a broad specrum of micro-, nano-, bio-, fiber-optic, and optoelectronic components and functions. This book is a powerful tool for understanding how to harness the power of nanotech through integration of materials, processes, devices, and applications.

This book introduces the exciting and fast-moving field of MOEMS to graduate students, scientists, and engineers by providing a foundation of both micro-optics and MEMS that will enable them to conduct future research in the field. Born from the relatively new fields of MEMS and micro-optics, MOEMS are proving to be an attractive and low-cost solution to a range of device problems requiring high optical functionality and high optical performance. MOEMS solutions include optical devices for telecommunication, sensing, and mobile systems such as v-grooves, gratings, shutters, scanners, filters, micromirrors, switches, alignment aids, lens arrays, and hermetic wafer-scale optical packaging. An international team of leading researchers contributed to this book, and it presents examples and problems employing cutting-edge MOEM devices. It will inspire researchers to further advance the design, fabrication, and analysis of MOEM systems.

This book-presents new methods and tools for the integration and simulation of smart devices. The design approach described in this book explicitly accounts for integration of Smart Systems components and subsystems as a specific constraint. It includes methodologies and EDA tools to enable multi-disciplinary and multi-scale modeling and design, simulation of multi-domain systems, subsystems and components at all levels of abstraction, system integration and exploration for optimization of functional and non-functional metrics. By covering theoretical and practical aspects of smart device design, this book targets people who are working and studying on hardware/software modelling, component integration and simulation under different positions (system integrators, designers, developers, researchers, teachers, students etc.). In particular, it is a good introduction to people who have interest in managing heterogeneous components in an efficient and effective way on different domains and different abstraction levels. People active in smart device development can understand both the current status of practice and future research directions. · Provides a comprehensive overview of smart systems design, focusing on design challenges and cutting-edge solutions; · Enables development of a co-simulation and co-design environment that accounts for the peculiarities of the basic subsystems and components to be integrated; · Describes development of modeling and design techniques, methods and tools that enable multi-domain simulation and optimization at various levels of abstraction and across different technological domains.