Sections 1-2. Keyword Index.--Section 3. Personal author index.--Section 4. Corporate author index.-- Section 5. Contract/grant number index, NTIS order/report number index 1-E.--Section 6. NTIS order/report number index F-Z.

The Compound-Nuclear Reaction and Related Topics (CNR*) international workshop series was initiated in 2007 with a meeting near Yosemite National Park. It has since been held in Bordeaux (2009), Prague (2011), Sao Paulo (2013), Tokyo (2015), and Berkeley, California (2018). The workshop series brings together experts in nuclear theory, experiment, data evaluations, and applications, and fosters interactions among these groups. Topics of interest include: nuclear reaction mechanisms, optical model, direct reactions and the compound nucleus, pre-equilibrium reactions, fusion and fission, cross section measurements (direct and indirect methods), Hauser-Feshbach theory (limits and extensions), compound-nuclear decays, particle and gamma emission, level densities, strength functions, nuclear structure for compound-nuclear reactions, nuclear energy, nuclear astrophysics, and other topics. This peer-reviewed proceedings volume presents papers and poster summaries from the 6th International Workshop on Compound-Nuclear Reactions and Related Topics CNR*18, held on September 24-28, 2018, at Lawrence Berkeley National Lab, Berkeley, CA.

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This book was first published in 1993.

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

While this book continues the spirit of the MRS series on materials science related to the development of electronic packaging, it also focuses on three very specific technological areas - technology for flip-chip packaging, materials metrology and characterization, and packaging reliability and testing. These are important areas for technology development in electronic packaging, particularly since materials and processing play an important role in controlling system performance and reliability. Topics include: flip-chip and solder technology; future packaging technology; manufacturing technology in packaging; packaging materials and metrology; interfacial adhesion and fracture and packaging reliability and testing.