This volume chronicles the proceedings of the Third Symposium on Particles on Surfaces : Detection, Adhesion and Removal held as a part of the 21st Annual Meeting of the Fine Particle Society in San Diego , California, August 21 - 25 , 1990 . The first two symposia i n t h i s series were held in 1986 and 1988 , respectively, and have been properly l documented ,2. Li ke its antecedent s the Third symposium was very well received, and the continuing success of these symposia reinforced our earlier belief that regular symposia on the topic of particles on surfaces were very much needed. Concomitantly, the fourth symposium in this series is planned in Las Vegas , July 13-17 , 199 2 . l As pointed out in the Preface to the earlier two volumes ,2, the topic of particles on surfaces is of tremendous interest and concern in a wide spectrum of technological areas . The objectives of the Third symposium were es s ent i a l ly the same as those of the earlier two and our intent her e was to provide an update on the research and development activities in the world of particles on surfaces . Apropos , there has been a deliberate attempt every time to s eek out new people to present their research results and we have been very succes s f ul in this mission.

Adhesive bonding is often effective, efficient, and often necessary way to join mechanical structures. This important book reviews the most recent improvements in adhesive bonding and their wide-ranging potential in structural engineering.Part one reviews advances in the most commonly used groups of structural adhesives with chapters covering topics such as epoxy, polyurethane, silicone, cyanoacrylate, and acrylic adhesives. The second set of chapters covers the various types of adherends and pre-treatment methods for a range of structural materials such as metals, composites and plastics. Chapters in Part three analyse methods and techniques with topics on joint design, life prediction, fracture mechanics and testing. The final group of chapters gives useful and practical insights into the problems and solutions of adhesive bonding in a variety of hostile environments such as chemical, wet and extreme temperatures.With its distinguished editor and international team of contributors, Advances in structural adhesive bonding is a standard reference for structural and chemical engineers in industry and the academic sector. - Reviews advances in the most commonly used groups of structural adhesives including epoxy, silicone and acrylic adhesives - Examines key issues in adhesive selection featuring substrate compatibility and manufacturing demands - Documents advances in bonding metals, plastics and composites recognising problems and limitations

This volume chronicles the proceedings of the Symposium on Particles on Surfaces: Detection, Adhesion and Removal held under the auspices of the Fine Particle Society in San Francisco, July 28-August 2, 1986. The study of particles on surfaces is extremely important in many areas of human endeavor (ranging from microelectronics to optics to biomedical). A complete catalog of modern precision and sophisticated technologies where particles on surfaces are of cardinal importance will be prohibitively long, but the following eclectic examples should underscore the concern about particles on a variety of surfaces. In the semiconductor world of shrinking dimensions, particles which, a few years ago, were cosmetically undesirable but functionally innocuous can potentially be killer defects now. As the device sizes get smaller, there will be more and more concern about smaller and smaller particles. In the information storage technology, the gap between the head and the disk is very narrow, and if a particle is trapped in the gap that can have very grave consequences. The implications of particulate contamination on sensitive optical surfaces is all too manifest. So the particulate contamination on surfaces is undesirable from functional, yield and reliability points of view. This symposium was organized with the following objectives in mind: to bring together active practitioners in this field; to provide a forum for discussion of the latest research and development activities in this area; to provide opportunity for cross-pollination of ideas; and to highlight topics which needed intensified effort.