IPFA 2015 will be devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures and issues related to semiconductor device reliability and yield, especially those related to advanced process technologies, which include Sample Preparation, Metrology and Material Characterization Advanced Failure Analysis Techniques Die Level Package Level Failure Analysis Case Study & Failure Mechanisms Novel CMOS Gate Stack Dielectrics and FEOL Reliability and Failure Mechanisms Product Reliability Evaluation and Approaches Device (Ge, III V, TFT, Memory, MEMS, LED etc ) Reliability and Failure Mechanisms Advanced Interconnects and BEOL Reliability and Failure Mechanism

The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.

The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.