Principles of Chemical Vapor Deposition provides a simple introduction to heat and mass transfer, surface and gas phase chemistry, and plasma discharge characteristics. In addition, the book includes discussions of practical films and reactors to help in the development of better processes and equipment. This book will assist workers new to chemical vapor deposition (CVD) to understand CVD reactors and processes and to comprehend and exploit the literature in the field. The book reviews several disparate fields with which many researchers may have only a passing acquaintance, such as heat and mass transfer, discharge physics, and surface chemistry, focusing on key issues relevant to CVD. The book also examines examples of realistic industrial reactors and processes with simplified analysis to demonstrate how to apply the principles to practical situations. The book does not attempt to exhaustively survey the literature or to intimidate the reader with irrelevant mathematical apparatus. This book is as simple as possible while still retaining the essential physics and chemistry. The book is generously illustrated to assist the reader in forming the mental images which are the basis of understanding.

Turn to this new second edition for an understanding of the latest advances in the chemical vapor deposition (CVD) process. CVD technology has recently grown at a rapid rate, and the number and scope of its applications and their impact on the market have increased considerably. The market is now estimated to be at least double that of a mere seven years ago when the first edition of this book was published. The second edition is an update with a considerably expanded and revised scope. Plasma CVD and metallo-organic CVD are two major factors in this rapid growth. Readers will find the latest data on both processes in this volume. Likewise, the book explains the growing importance of CVD in production of semiconductor and related applications.

In early 1987 I was attempting to develop a CVD-based tungsten process for Intel. At every step ofthe development, information that we were collecting had to be analyzed in light of theories and hypotheses from books and papers in many unrelated subjects. Thesesources were so widely different that I came to realize there was no unifying treatment of CVD and its subprocesses. More interestingly, my colleagues in the industry were from many disciplines (a surface chemist, a mechanical engineer, a geologist, and an electrical engineer werein my group). To help us understand the field of CVD and its players, some of us organized the CVD user's group of Northern California in 1988. The idea for writing a book on the subject occurred to me during that time. I had already organized my thoughts for a course I taught at San Jose State University. Later Van Nostrand agreed to publish my book as a text intended for students at the senior/first year graduate level and for process engineers in the microelectronics industry, This book is not intended to be bibliographical, and it does not cover every new material being studied for chemical vapor deposition. On the other hand, it does present the principles of CVD at a fundamental level while uniting them with the needs of the microelectronics industry.

"Chemical Vapour Deposition: An Integrated Engineering Design for Advanced Materials" focuses on the application of this technology to engineering coatings and, in particular, to the manufacture of high performance materials, such as fibre reinforced ceramic composite materials, for structural applications at high temperatures. This book aims to provide a thorough exploration of the design and applications of advanced materials, and their manufacture in engineering. From physical fundamentals and principles, to optimization of processing parameters and other current practices, this book is designed to guide readers through the development of both high performance materials and the design of CVD systems to manufacture such materials. "Chemical Vapour Deposition: An Integrated Engineering Design for Advanced Materials" introduces integrated design and manufacture of advanced materials to researchers, industrial practitioners, postgraduates and senior undergraduate students.

The goal of producing devices that are smaller, faster, more functional, reproducible, reliable and economical has given thin film processing a unique role in technology.Principles of Vapor Deposition of Thin Films brings in to one place a diverse amount of scientific background that is considered essential to become knowledgeable in thin film depostition techniques. Its ultimate goal as a reference is to provide the foundation upon which thin film science and technological innovation are possible.* Offers detailed derivation of important formulae.* Thoroughly covers the basic principles of materials science that are important to any thin film preparation.* Careful attention to terminologies, concepts and definitions, as well as abundance of illustrations offer clear support for the text.

This wide-ranging volume covers recent developments in the theoretical understanding of the chemistry and physics of chemical vapour deposition (CVD). Contributors are drawn from both academia and industry to achieve a balaced coverage of the subject. The volume emphasizes principles and understanding rather than details of specific materials or processes. Specific examples are given to illustrate the principles.

In this monograph, the authors offer a comprehensive examination of the latest research on Laser Chemical Vapor Deposition (LCVD). Chapters explore the physics of LCVD as well as the principles of a wide range of related phenomena-including laser-matter interactions, heat transfer, fluid flow, chemical kinetics, and adsorption. With this reference, researchers will discover how to apply these principles to developing theories about various types of LCVD processes; gain greater insight into the basic mechanisms of LCVD; and obtain the ability to design and control an LCVD system.