This unique collection of knowledge represents a comprehensive treatment of the fundamental and practical consequences of size reduction in silicon crystals. This clearly structured reference introduces readers to the optical, electrical and thermal properties of silicon nanocrystals that arise from their greatly reduced dimensions. It covers their synthesis and characterization from both chemical and physical viewpoints, including ion implantation, colloidal synthesis and vapor deposition methods. A major part of the text is devoted to applications in microelectronics as well as photonics and nanobiotechnology, making this of great interest to the high-tech industry.

The dense plasma focus system of energy 2.3 kJ was used to synthesize titanium based nitride thin films. The book contains the details of research work including the introduction, plasma focus experimental setup, results obtained and their detailed discussion. It reports growth of titanium based nitride thin films specifically titanium-aluminum nitrides, nano composite-titanium nitride/amorphous-silicon nitride, nano composite (titanium, aluminum) nitride/ amorphous-silicon nitride and titanium-silicon-nitride. The results of these experiments show the successful synthesis of titanium based nitride thin films using the plasma focus system. The research work is motivated by the remarkable mechanical, thermal and electronic properties of titanium based nitride thin films, having many applications ranging from coatings on cutting tools to diffusion barrier in microelectronics.

Titanium tetrachioride and ammonia were used as precursors in a Jow pressure chemical vapor deposition process to deposit titanium nitride films on silicon wafers. The process was carried out at temperatures from 450 to 850°C and the activation energy for the reaction was determined. The order of the reaction, with respect to the partial pressures of the reactant gases, was determined by carrying out the reaction at varying partial pressures of the reactant gases. The following rate equation was established for the reaction: rate = 4.35*10-5exp( -5150/T)*(PNH3)1.37(PTicl4)-0.42 The titanium nitride thin films deposited were characterized for properties like resistivity, stress, hardness, and density. The effects of varying the process parameters (temperature, flow ratio, etc.) on these film properties were studied.