This book aims to provide a comprehensive reference into the critical subject of failure and degradation in organic materials, used in optoelectronics and microelectronics systems and devices. Readers in different industrial sectors, including microelectronics, automotive, lighting, oil/gas, and petrochemical will benefit from this book. Several case studies and examples are discussed, which readers will find useful to assess and mitigate similar failure cases. More importantly, this book presents methodologies and useful approaches in analyzing a failure and in relating a failure to the reliability of materials and systems.

RELIABILITY PREDICTION FOR MICROELECTRONICS Wiley Series in Quality & Reliability Engineering REVOLUTIONIZE YOUR APPROACH TO RELIABILITY ASSESSMENT WITH THIS GROUNDBREAKING BOOK Reliability evaluation is a critical aspect of engineering, without which safe performance within desired parameters over the lifespan of machines cannot be guaranteed. With microelectronics in particular, the challenges to evaluating reliability are considerable, and statistical methods for creating microelectronic reliability standards are complex. With nano-scale microelectronic devices increasingly prominent in modern life, it has never been more important to understand the tools available to evaluate reliability. Reliability Prediction for Microelectronics meets this need with a cluster of tools built around principles of reliability physics and the concept of remaining useful life (RUL). It takes as its core subject the ‘physics of failure’, combining a thorough understanding of conventional approaches to reliability evaluation with a keen knowledge of their blind spots. It equips engineers and researchers with the capacity to overcome decades of errant reliability physics and place their work on a sound engineering footing. Reliability Prediction for Microelectronics readers will also find: Focus on the tools required to perform reliability assessments in real operating conditions Detailed discussion of topics including failure foundation, reliability testing, acceleration factor calculation, and more New multi-physics of failure on DSM technologies, including TDDB, EM, HCI, and BTI Reliability Prediction for Microelectronics is ideal for reliability and quality engineers, design engineers, and advanced engineering students looking to understand this crucial area of product design and testing.

This book provides engineers and scientists with a single source introduction to the concepts, models, and case studies for making credible reliability assessments. It satisfies the need for thorough discussions of several fundamental subjects. Section I contains a comprehensive overview of assessing and assuring reliability that is followed by discussions of: • Concept of randomness and its relationship to chaos • Uses and limitations of the binomial and Poisson distributions • Relationship of the chi-square method and Poisson curves • Derivations and applications of the exponential, Weibull, and lognormal models • Examination of the human mortality bathtub curve as a template for components Section II introduces the case study modeling of failure data and is followed by analyses of: • 5 sets of ideal Weibull, lognormal, and normal failure data • 83 sets of actual (real) failure data The intent of the modeling was to find the best descriptions of the failures using statistical life models, principally the Weibull, lognormal, and normal models, for characterizing the failure probability distributions of the times-, cycles-, and miles-to-failure during laboratory or field testing. The statistical model providing the preferred characterization was determined empirically by choosing the two-parameter model that gave the best straight-line fit in the failure probability plots using a combination of visual inspection and three statistical goodness-of-fit (GoF) tests. This book offers practical insight in dealing with single item reliability and illustrates the use of reliability methods to solve industry problems.

This work will educate chip and system designers on a method for accurately predicting circuit and system reliability in order to estimate failures that will occur in the field as a function of operating conditions at the chip level. This book will combine the knowledge taught in many reliability publications and illustrate how to use the knowledge presented by the semiconductor manufacturing companies in combination with the HTOL end-of-life testing that is currently performed by the chip suppliers as part of their standard qualification procedure and make accurate reliability predictions. This book will allow chip designers to predict FIT and DPPM values as a function of operating conditions and chip temperature so that users ultimately will have control of reliability in their design so the reliability and performance will be considered concurrently with their design. - The ability to include reliability calculations and test results in their product design - The ability to use reliability data provided to them by their suppliers to make meaningful reliability predictions - Have accurate failure rate calculations for calculating warrantee period replacement costs

Researchers from the entire world write to figure out their newest results and to contribute new ideas or ways in the field of system reliability and maintenance. Their articles are grouped into four sections: reliability, reliability of electronic devices, power system reliability and feasibility and maintenance. The book is a valuable tool for professors, students and professionals, with its presentation of issues that may be taken as examples applicable to practical situations. Some examples defining the contents can be highlighted: system reliability analysis based on goal-oriented methodology; reliability design of water-dispensing systems; reliability evaluation of drivetrains for off-highway machines; extending the useful life of asset; network reliability for faster feasibility decision; analysis of standard reliability parameters of technical systems' parts; cannibalisation for improving system reliability; mathematical study on the multiple temperature operational life testing procedure, for electronic industry; reliability prediction of smart maximum power point converter in photovoltaic applications; reliability of die interconnections used in plastic discrete power packages; the effects of mechanical and electrical straining on performances of conventional thick-film resistors; software and hardware development in the electric power system; electric interruptions and loss of supply in power systems; feasibility of autonomous hybrid AC/DC microgrid system; predictive modelling of emergency services in electric power distribution systems; web-based decision-support system in the electric power distribution system; preventive maintenance of a repairable equipment operating in severe environment; and others.

A perennial bestseller, the Digital Avionics Handbook offers a comprehensive view of avionics. Complete with case studies of avionics architectures as well as examples of modern systems flying on current military and civil aircraft, this Third Edition includes: Ten brand-new chapters covering new topics and emerging trends Significant restructuring to deliver a more coherent and cohesive story Updates to all existing chapters to reflect the latest software and technologies Featuring discussions of new data bus and display concepts involving retina scanning, speech interaction, and synthetic vision, the Digital Avionics Handbook, Third Edition provides practicing and aspiring electrical, aerospace, avionics, and control systems engineers with a pragmatic look at the present state of the art of avionics.