The attractive physical and mechanical properties of ordered intermetallic alloys have been recognized since early in this century. However, periodic attempts to develop intermetallics for structural applications were unsuc cessful, due in major part to the twin handicaps of inadequate low-temper ature ductility or toughness, together with poor elevated-temperature creep strength. The discovery, in 1979, by Aoki and Izumi in Japan that small additions of boron caused a dramatic improvement in the ductility of Ni3Al was a major factor in launching a new wave of fundamental and applied research on intermetallics. Another important factor was the issuance in 1984 of a National Materials Advisory Board reported entitled "Structural Uses for Ductile Ordered Alloys," which identified numerous potential defense-related applications and proposed the launching of a coordinated development program to gather engineering property and processing data. A substantial research effort on titanium aluminides was already underway at the Air Force Materials Laboratory at Wright Patterson Air Force Base in Ohio and, with Air Force support, at several industrial and university laboratories. Smaller programs also were under way at Oak Ridge National Laboratory, under Department of Energy sponsorship. These research efforts were soon augmented in the United States by funding from Department of Defense agencies such as Office of Naval Research and Air Force Office of Scientific Research, and by the National Science Foundation.

Ordered intermetallics constitute a unique class of metallic materials which may be developed as new-generation materials for structural use at high temperatures in hostile environments. At present, there is a worldwide interest in intermetallics, and extensive efforts have been devoted to intermetallic research and development in the U.S., Japan, European countries, and other nations. As a result, significant advances have been made in all areas of intermetallic research. This NATO Advanced Workshop on ordered intermetallics (1) reviews the recent progress, and (2) assesses the future direction of intermetallic research in the areas of electronic structure and phase stability, deformation and fracture, and high-temperature properties. The book is divided into six parts: (1) Electronic Structure and Phase Stability; (2) Deformation and Dislocation Structures; (3) Ductility and Fracture; (4) Kinetic Processes and Creep Behavior; (5) Research Programs and Highlights; and (6) Assessment of Current Research and Recommendation for Future Work. The first four parts review the recent advances in the three focus areas. The fifth part provides highlights of the intermetallic research under major programs and in different institutes and countries. The last part provides a forum for the discussion of research areas for future studies.

Modern Physical Metallurgy, Fourth Edition explains the fundamental principles of physical metallurgy and their application, allowing its readers to understand the many important technological phenomena of the field. The book covers topics such as the molecular properties of metals; the different physical methods of metals and alloys; and the structure of alloys. Also covered are topics such as the deformation of metals and alloys; phase transformations; and related processes such as creep, fatigue, fracture, oxidation, and corrosion. The text is recommended for metallurgists, chemists, and engineers who would like to know more about the principles behind metallurgy and its application in different fields.

Physical metallurgy is one of the main fields of metallurgical science dealing with the development of the microstructure of metals in order to achieve desirable properties required in technological applications. Physical Metallurgy: Principles and Design focuses on the processing–structure–properties triangle as it applies to metals and alloys. It introduces the fundamental principles of physical metallurgy and the design methodologies for alloys and processing. The first part of the book discusses the structure and change of structure through phase transformations. The latter part of the books deals with plastic deformation, strengthening mechanisms, and mechanical properties as they relate to structure. The book also includes a chapter on physical metallurgy of steels and concludes by discussing the computational tools, involving computational thermodynamics and kinetics, to perform alloy and process design.

Intermetallic Matrix Composites: Properties and Applications is a comprehensive guide that studies the types and properties of intermetallic matrix composites, including their processing techniques, characterization and the various testing methods associated with these composites. In addition, it presents modeling techniques, their strengthening mechanisms and the important area of failure and repair. Advanced /complex IMCs are then explained, such as Self-healing IMCs and laminated intermetallic composites. The book concludes by delving into the industries that use these materials, including the automotive industry. - Reviews the latest research in intermetallic matrix composites - Contains a focus on properties and applications - Includes contributions from leading experts in the field

Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other topics, the book addresses: · Developments in process engineering (SMT, Wave, Rework, Paste Technology) · Low temperature, high temperature and high reliability alloys · Intermetallic compounds · PCB surface finishes and laminates · Underfills, encapsulants and conformal coatings · Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book’s explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements.

This book provides a systematic and comprehensive description of high-entropy alloys (HEAs). The authors summarize key properties of HEAs from the perspective of both fundamental understanding and applications, which are supported by in-depth analyses. The book also contains computational modeling in tackling HEAs, which help elucidate the formation mechanisms and properties of HEAs from various length and time scales.