In electronic circuit and system design, the word noise is used to refer to any undesired excitation on the system. In other contexts, noise is also used to refer to signals or excitations which exhibit chaotic or random behavior. The source of noise can be either internal or external to the system. For instance, the thermal and shot noise generated within integrated circuit devices are in ternal noise sources, and the noise picked up from the environment through electromagnetic interference is an external one. Electromagnetic interference can also occur between different components of the same system. In integrated circuits (Ies), signals in one part of the system can propagate to the other parts of the same system through electromagnetic coupling, power supply lines and the Ie substrate. For instance, in a mixed-signal Ie, the switching activity in the digital parts of the circuit can adversely affect the performance of the analog section of the circuit by traveling through the power supply lines and the substrate. Prediction of the effect of these noise sources on the performance of an electronic system is called noise analysis or noise simulation. A methodology for the noise analysis or simulation of an electronic system usually has the following four components: 2 NOISE IN NONLINEAR ELECTRONIC CIRCUITS • Mathematical representations or models for the noise sources. • Mathematical model or representation for the system that is under the in fluence of the noise sources.

Provides an overview of the physical basis of noise in semiconductor devices, and a detailed treatment of numerical noise simulation in small-signal conditions. It presents innovative developments in the noise simulation of semiconductor devices operating in large-signal quasi-periodic conditions.

Analog circuit design has grown in importance because so many circuits cannot be realized with digital techniques. Examples are receiver front-ends, particle detector circuits, etc. Actually, all circuits which require high precision, high speed and low power consumption need analog solutions. High precision also needs low noise. Much has been written already on low noise design and optimization for low noise. Very little is available however if the source is not resistive but capacitive or inductive as is the case with antennas or semiconductor detectors. This book provides design techniques for these types of optimization. This book is thus intended firstly for engineers on senior or graduate level who have already designed their first operational amplifiers and want to go further. It is especially for engineers who do not want just a circuit but the best circuit. Design techniques are given that lead to the best performance within a certain technology. Moreover, this is done for all important technologies such as bipolar, CMOS and BiCMOS. Secondly, this book is intended for engineers who want to understand what they are doing. The design techniques are intended to provide insight. In this way, the design techniques can easily be extended to other circuits as well. Also, the design techniques form a first step towards design automation. Thirdly, this book is intended for analog design engineers who want to become familiar with both bipolar and CMOS technologies and who want to learn more about which transistor to choose in BiCMOS.

This monograph presents our recent research on Simultaneous Switching Noise (SSN) and related issues for CMOS based systems. Although some SSN related work was previously reported in the literature, it were mainly for Emitter Coupled Logic (ECL) gates using Bipolar Junction Transistors (BJTs). This present work covers in-depth analysis on estimating SSN and its impact for CMOS based devices and systems. At present semiconductor industries are moving towards scaled CMOS devices and reduced supply voltage. SSN together with coupled noise may limit the packing density, and thereby the frequency of operation of packaged systems. Our goal is to provide efficient and yet reliable methodologies and algorithms to estimate the overall noise containment in single chip and multi-chip package assemblies. We hope that the techniques and results described in this book will be useful as guides for design, package, and system engineers and academia working in this area. Through this monograph, we hope that we have shown the necessity of interactions that are essential between chip design, system design and package design engineers to design and manufacture optimal packaged systems. Work reported in this monograph was partially supported by the grant from Semiconductor Research Corporation (SRC Contract No. 92-MP-086).

Noise Coupling is the root-cause of the majority of Systems on Chip (SoC) product fails. The book discusses a breakthrough substrate coupling analysis flow and modelling toolset, addressing the needs of the design community. The flow provides capability to analyze noise components, propagating through the substrate, the parasitic interconnects and the package. Using this book, the reader can analyze and avoid complex noise coupling that degrades RF and mixed signal design performance, while reducing the need for conservative design practices. With chapters written by leading international experts in the field, novel methodologies are provided to identify noise coupling in silicon. It additionally features case studies that can be found in any modern CMOS SoC product for mobile communications, automotive applications and readout front ends.