Micro-assembly is a key enabling technology for cost effective manufacture of new generations of complex micro products. It is also a critical technology for retaining mdustrial capabilities in high labour cost areas such as Europe since up to 80% of the production cost in some industries is attributed directly to assembly processes. With the continuous trend for product miniaturisation, the scientific and technologi cal developments in micro-assembly are expected to have a significant long-term economic, demographic and social impact. A distinctive feature of the process is that surface forces are often dominant over gravity forces, which determines a number of specific technical challenges. Critical areas which are currently being addressed include development of assembly systems with high positional accuracy, micro gripping methods that take into ac count the adhesive surface forces, high precision micro-feeding techniques and mi cro-joining processes. Micro-assembly has developed rapidly over the last few years and all the pre dictions are that it will remain a critical technology for high value products in a number of key sectors such as healthcare, communications, defence and aerospace. The key challenge is to match the significant technological developments with a new generation of micro products that will establish firmly micro-assembly as a core manufacturing process.

The development of new-generation micro-manufacturing technologies and systems has revolutionised the way products are designed and manufactured today with a s- nificant impact in a number of key industrial sectors. Micro-manufacturing techno- gies are often described as disruptive, enabling and interdisciplinary leading to the creation of whole new classes of products that were previously not feasible to ma- facture. While key processes for volume manufacture of micro-parts such as mach- ing and moulding are becoming mature technologies, micro-assembly remains a key challenge for the cost-effective manufacture of complex micro-products. The ability to manufacture customizable micro-products that can be delivered in variable volumes within relatively short timescales is very much dependent on the level of development of the micro-assembly processes, positioning, alignment and measurement techniques, gripping and feeding approaches and devices. Micro-assembly has developed rapidly over the last few years and all the pred- tions are that it will remain a critical technology for high-value products in a number of key sectors such as healthcare, communications, defence and aerospace. The key challenge is to match the significant technological developments with a new gene- tion of micro-products that will establish firmly micro-assembly as a mature manuf- turing process. th The book includes the set of papers presented at the 5 International Precision - sembly Seminar IPAS 2010 held in Chamonix, France from the 14th to the 17th February 2010.

This book provides in-depth theoretical and practical information on recent advances in micro-manufacturing technologies and processes, covering such topics as micro-injection moulding, micro-cutting, micro-EDM, micro-assembly, micro-additive manufacturing, moulded interconnected devices, and microscale metrology. It is designed to provide complementary material for the related e-learning platform on micro-manufacturing developed within the framework of the Leonardo da Vinci project 2013-3748/542424: MIMAN-T: Micro-Manufacturing Training System for SMEs. The book is mainly addressed to technicians and prospective professionals in the sector and will serve as an easily usable tool to facilitate the translation of micro-manufacturing technologies into tangible industrial benefits. Numerous examples are included to assist readers in learning and implementing the described technologies. In addition, an individual chapter is devoted to technological foresight, addressing market analysis and business models for micro-manufacturers.

These contributions to the 3rd IPAS'2006 seminar are grouped in 6 sections. Part 1 reviews new techniques for handling and feeding micro parts. Micro-robotics and robot applications for micro assembly are discussed in Part 2. An overview of different design and planning applications for microassembly is provided in Part 3. Part 4 covers reconfigurable and modular micro assembly systems and control applications. The economic aspects of microassembly including new business models are discussed in Part 5 while Part 6 presents specific technical solutions and microassembly applications.

Keynote Paper.- Augmented Reality in Assembly Systems: State of the Art and Future Perspectives.- Assembly Design and Planning.- Application of a Standardized Design Procedure in the Development of Automated Micro-Assembly Processes.- Towards the Automated Coverlay Assembly in FPCB Manufacturing: Concept and Preliminary Tests.- Resource Interface Matchmaking as a Part of Automatic Capacity Matchmaking.- Investigation on the Convergence of the Genetic Algorithm of an Aerodynamic Feeding System due to the Enlargement of the Solution Space.- Assembly Operations.- Indirect System Condition Monitoring using Online Bayesian Changepoint Direction.- Strategies for Dealing with Problems in Robotised Unscrewing Operations.- Improving Automated Insertion Task in Robotics by Reducing Registration Error.- Assembly Cells and Systems.- Development of a Sensitive Winding Application Based on a Serial Robot and Integrated Torque Sensors.- High-Load Titanium Drilling using an Accurate Robotic Machining System.- Application of Advanced Simulation Methods for the Tolerance Analysis of Mechanical Assemblies.- Development of a Low-Cost, High Accuracy, Flexible Panel Indexing Cell with Modular, Elastic Architecture.- Context-Aware Plug and Produce for Robotic Aerospace Assembly.- Data Capture and Visualisation on a Shoestring: Demonstrating the Digital Manufacturing on a Shoestring Project.- Digital Innovation Hubs for Enhancing the Technology Transfer and Digital Transformation of the European Manufacturing Industry.- Plenoptic Inspection System for Automatic Quality Control of MEMS and Microsystems.- Human Centred Assembly.- Automated Information Supply of Worker Guidance Systems in Smart Assembly Environment.- Towards Human and Robot Collaborative Ergonomic Handling of Long Parts with a Loose Grip.- Human and Workcell Event Recognition and its Application Areas in Industrial Assembly.- Cognitive Acceptance to Support Maintenance and Assembly Tasks: Results on Technology Acceptance of a Head-Mounted Device.- Usability Study of Learning-Based Pose Estimation of Industrial Objects from Synthetic Depth Data.- Assistance Methods in Assembly.- Assistance Needs in Production Environments: A Contextual Exploration of Workers' Experiences and Work Practices.- Attention Analysis for Assistance in Assembly Processes.- Live Video Assistance Systems for Assembly Processes.- Orchestration and Situation Awareness in an Assistance System for Assembly Task.- Safety as Bad Cop of Physical Assistance Systems?.- The Consideration of Job Satisfaction in the Design of Assistance Systems in Production.

This Proceedings volume contains articles presented at the CIRP-Sponsored Inter- tional Conference on Digital Enterprise Technology (DET2009) that takes place December 14–16, 2009 in Hong Kong. This is the 6th DET conference in the series and the first to be held in Asia. Professor Paul Maropoulos initiated, hosted and chaired the 1st International DET Conference held in 2002 at the University of D- ham. Since this inaugural first DET conference, DET conference series has been s- cessfully held in 2004 at Seattle, Washington USA, in 2006 at Setubal Portugal, in 2007 at Bath England, and in 2008 at Nantes France. The DET2009 conference continues to bring together International expertise from the academic and industrial fields, pushing forward the boundaries of research kno- edge and best practice in digital enterprise technology for design and manufacturing, and logistics and supply chain management. Over 120 papers from over 10 countries have been accepted for presentation at DET2009 and inclusion in this Proceedings volume after stringent refereeing process. On behalf of the organizing and program committees, the Editors are grateful to the many people who have made DET2009 possible: to the authors and presenters, es- cially the keynote speakers, to those who have diligently reviewed submissions, to members of International Scientific Committee, Organizing Committee and Advisory Committes, and to colleagues for their hard work in sorting out all the arrangements. We would also like to extend our gratitude to DET2009 sponsors, co-organizers, and supporting organizations.

The silicon age that led the computer revolution has significantly changed the world. The next 30 years will see the incorporation of new types of functionality onto the chip-structures that will enable the chip to reason, to sense, to act and to communicate. Micromachining technologies offer a wide range of possibilities for active and passive devices. Recent developments have produced sensors, actuators and optical systems. Many of these technologies are based on surface micromachining, which has evolved from silicon integrated circuit technology. This book is written by experts in the field. It contains useful details in design and processing and can be utilized as a reference book or as a textbook.