Over the past two decades, technologies for microsystems fabrication have made considerable progress. This has made possible a large variety of new commercial devices ranging, for example, from integrated pressure and acceleration microsensors to active micromirror arrays for image projection. In the near future, there will be a number of new devices, which will be commercialized in many application areas. The field of microsystems is characterized by its wide diversity, which requires a multidisciplinary approach for design and processes as well as in application areas. Although there is a common technological background derived from integrated circuits, it is clear that microsystems will require additional application-specific technologies. Since most microsystem technologies are based on batch processing and dedicated to mass production, prototyping is likely to be an expensive and time-consuming step. It is recognized that standardization of the processes as well as of the design tools will definitely help reduce the entry cost of microsystems. This creates a very challenging situation for the design, modeling and simulation of microsystems. Methodology for the Modeling and Simulation of Microsystems is the first book to give an overview of the problems associated with modeling and simulation of microsystems. It introduces a new methodology, which is supported by several examples. It should provide a useful starting point for both scientists and engineers seeking background information for efficient design of microsystems.

Master modeling and simulation using Modelica, the new powerful, highly versatile object-based modeling language Modelica, the new object-based software/hardware modeling language that is quickly gaining popularity around the world, offers an almost universal approach to high-level computational modeling and simulation. It handles a broad range of application domains, for example mechanics, electrical systems, control, and thermodynamics, and facilitates general notation as well as powerful abstractions and efficient implementations. Using the versatile Modelica language and its associated technology, this text presents an object-oriented, component-based approach that makes it possible for readers to quickly master the basics of computer-supported equation-based object-oriented (EOO) mathematical modeling and simulation. Throughout the text, Modelica is used to illustrate the various aspects of modeling and simulation. At the same time, a number of key concepts underlying the Modelica language are explained with the use of modeling and simulation examples. This book: Examines basic concepts such as systems, models, and simulations Guides readers through the Modelica language with the aid of several step-by-step examples Introduces the Modelica class concept and its use in graphical and textual modeling Explores modeling methodology for continuous, discrete, and hybrid systems Presents an overview of the Modelica Standard Library and key Modelica model libraries Readers will find plenty of examples of models that simulate distinct application domains as well as examples that combine several domains. All the examples and exercises in the text are available via DrModelica. This electronic self-teaching program, freely available on the text's companion website, guides readers from simple, introductory examples and exercises to more advanced ones. Written by the Director of the Open Source Modelica Consortium, Introduction to Modeling and Simulation of Technical and Physical Systems with Modelica is recommended for engineers and students interested in computer-aided design, modeling, simulation, and analysis of technical and natural systems. By building on basic concepts, the text is ideal for students who want to learn modeling, simulation, and object orientation.

When I attended college we studied vacuum tubes in our junior year. At that time an average radio had ?ve vacuum tubes and better ones even seven. Then transistors appeared in 1960s. A good radio was judged to be one with more thententransistors. Latergoodradioshad15–20transistors and after that everyone stopped counting transistors. Today modern processors runing personal computers have over 10milliontransistorsandmoremillionswillbeaddedevery year. The difference between 20 and 20M is in complexity, methodology and business models. Designs with 20 tr- sistors are easily generated by design engineers without any tools, whilst designs with 20M transistors can not be done by humans in reasonable time without the help of Prof. Dr. Gajski demonstrates the Y-chart automation. This difference in complexity introduced a paradigm shift which required sophisticated methods and tools, and introduced design automation into design practice. By the decomposition of the design process into many tasks and abstraction levels the methodology of designing chips or systems has also evolved. Similarly, the business model has changed from vertical integration, in which one company did all the tasks from product speci?cation to manufacturing, to globally distributed, client server production in which most of the design and manufacturing tasks are outsourced.

Dieses Buch ist eine unschätzbare Informationsquelle für alle Ingenieure, Designer, Manager und Techniker bei Entwicklung, Studium und Anwendung einer großen Vielzahl von Simulationstechniken. Es vereint die Arbeit internationaler Simulationsexperten aus Industrie und Forschung. Alle Aspekte der Simulation werden in diesem umfangreichen Nachschlagewerk abgedeckt. Der Leser wird vertraut gemacht mit den verschiedenen Techniken von Industriesimulationen sowie mit Einsatz, Anwendungen und Entwicklungen. Neueste Fortschritte wie z.B. objektorientierte Programmierung werden ebenso behandelt wie Richtlinien für den erfolgreichen Umgang mit simulationsgestützten Prozessen. Auch gibt es eine Liste mit den wichtigsten Vertriebs- und Zulieferadressen. (10/98)

System-level modeling of MEMS - microelectromechanical systems - comprises integrated approaches to simulate, understand, and optimize the performance of sensors, actuators, and microsystems, taking into account the intricacies of the interplay between mechanical and electrical properties, circuitry, packaging, and design considerations. Thereby, system-level modeling overcomes the limitations inherent to methods that focus only on one of these aspects and do not incorporate their mutual dependencies. The book addresses the two most important approaches of system-level modeling, namely physics-based modeling with lumped elements and mathematical modeling employing model order reduction methods, with an emphasis on combining single device models to entire systems. At a clearly understandable and sufficiently detailed level the readers are made familiar with the physical and mathematical underpinnings of MEMS modeling. This enables them to choose the adequate methods for the respective application needs. This work is an invaluable resource for all materials scientists, electrical engineers, scientists working in the semiconductor and/or sensor industry, physicists, and physical chemists.

A comprehensive guide to MEMS materials, technologies and manufacturing, examining the state of the art with a particular emphasis on current and future applications. Key topics covered include: - Silicon as MEMS material - Material properties and measurement techniques - Analytical methods used in materials characterization - Modeling in MEMS - Measuring MEMS - Micromachining technologies in MEMS - Encapsulation of MEMS components - Emerging process technologies, including ALD and porous silicon Written by 73 world class MEMS contributors from around the globe, this volume covers materials selection as well as the most important process steps in bulk micromachining, fulfilling the needs of device design engineers and process or development engineers working in manufacturing processes. It also provides a comprehensive reference for the industrial R&D and academic communities. - Veikko Lindroos is Professor of Physical Metallurgy and Materials Science at Helsinki University of Technology, Finland. - Markku Tilli is Senior Vice President of Research at Okmetic, Vantaa, Finland. - Ari Lehto is Professor of Silicon Technology at Helsinki University of Technology, Finland. - Teruaki Motooka is Professor at the Department of Materials Science and Engineering, Kyushu University, Japan. - Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques - Shows how to protect devices from the environment and decrease package size for dramatic reduction of packaging costs - Discusses properties, preparation, and growth of silicon crystals and wafers - Explains the many properties (mechanical, electrostatic, optical, etc), manufacturing, processing, measuring (incl. focused beam techniques), and multiscale modeling methods of MEMS structures

This significant and uniquely comprehensive five-volume reference is a valuable source for research workers, practitioners, computer scientists, students, and technologists. It covers all of the major topics within the subject and offers a comprehensive treatment of MEMS design, fabrication techniques, and manufacturing methods. It also includes current medical applications of MEMS technology and provides applications of MEMS to opto-electronic devices. It is clearly written, self-contained, and accessible, with helpful standard features including an introduction, summary, extensive figures and design examples with comprehensive reference lists.