This book describes LSI process technology, and focuses on the rapid progress of state-of-the-art dynamic random access memory (DRAM) process technologies—the longstanding technology driver of Si ULSI—as they advance from the 1 Kbit to the Gbit DRAM era.

Microprocessors and Microcomputer-Based System Design, Second Edition, builds on the concepts of the first edition. It discusses the basics of microprocessors, various 32-bit microprocessors, the 8085 microprocessor, the fundamentals of peripheral interfacing, and Intel and Motorola microprocessors. This edition includes new topics such as floating-point arithmetic, Program Array Logic, and flash memories. It covers the popular Intel 80486/80960 and Motorola 68040 as well as the Pentium and PowerPC microprocessors. The final chapter presents system design concepts, applying the design principles covered in previous chapters to sample problems.

The modern electronic testing has a forty year history. Test professionals hold some fairly large conferences and numerous workshops, have a journal, and there are over one hundred books on testing. Still, a full course on testing is offered only at a few universities, mostly by professors who have a research interest in this area. Apparently, most professors would not have taken a course on electronic testing when they were students. Other than the computer engineering curriculum being too crowded, the major reason cited for the absence of a course on electronic testing is the lack of a suitable textbook. For VLSI the foundation was provided by semiconductor device techn- ogy, circuit design, and electronic testing. In a computer engineering curriculum, therefore, it is necessary that foundations should be taught before applications. The field of VLSI has expanded to systems-on-a-chip, which include digital, memory, and mixed-signalsubsystems. To our knowledge this is the first textbook to cover all three types of electronic circuits. We have written this textbook for an undergraduate “foundations” course on electronic testing. Obviously, it is too voluminous for a one-semester course and a teacher will have to select from the topics. We did not restrict such freedom because the selection may depend upon the individual expertise and interests. Besides, there is merit in having a larger book that will retain its usefulness for the owner even after the completion of the course. With equal tenacity, we address the needs of three other groups of readers.

This book covers the proceedings of the 8th International Conference on Microelectronics, Circuits, and Systems (Micro2021) having design and developments of devices, micro- and nanotechnologies, and electronic appliances. This book includes the latest developments and emerging research topics in material sciences, devices, microelectronics, circuits, nanotechnology, system design and testing, simulation, sensors, photovoltaics, optoelectronics, and its different applications. This book is of great attraction to researchers and professionals working in electronics, microelectronics, electrical, and computer engineering.

THE CONTEXT OF PARALLEL PROCESSING The field of digital computer architecture has grown explosively in the past two decades. Through a steady stream of experimental research, tool-building efforts, and theoretical studies, the design of an instruction-set architecture, once considered an art, has been transformed into one of the most quantitative branches of computer technology. At the same time, better understanding of various forms of concurrency, from standard pipelining to massive parallelism, and invention of architectural structures to support a reasonably efficient and user-friendly programming model for such systems, has allowed hardware performance to continue its exponential growth. This trend is expected to continue in the near future. This explosive growth, linked with the expectation that performance will continue its exponential rise with each new generation of hardware and that (in stark contrast to software) computer hardware will function correctly as soon as it comes off the assembly line, has its down side. It has led to unprecedented hardware complexity and almost intolerable dev- opment costs. The challenge facing current and future computer designers is to institute simplicity where we now have complexity; to use fundamental theories being developed in this area to gain performance and ease-of-use benefits from simpler circuits; to understand the interplay between technological capabilities and limitations, on the one hand, and design decisions based on user and application requirements on the other.

High Tech Society is the most definitive account available of the technology revolution that is transforming society and dramatically changing the way we live and work and maybe even think. It provides a balanced and sane overview of the opportunities as well as the dangers we face from new advances in information technology. In plain English, Forester demystifies "computerese," defining and explaining a host of acronyms or computer terms now in use.Tom Forester is Lecturer and Director of the Foundation Programme in the School of Computing and Information Technology, Griffith University, Queensland, Australia. He is the editor/author of five books on technology and society.

Because of their widespread use in mainframes, PCs, and mobile audio and video devices, DRAMs are being manufactured in ever increasing volume, both in stand-alone and in embedded form as part of a system on chip. Due to the optimum design of their components—access transistor, storage capacitor, and peripherals—DRAMs are the cheapest and densest semiconductor memory currently available. As a result, most of DRAM structure research and development focuses on the technology used for its constituent components and their interconnections. However, only a few books are available on semiconductor memories in general and fewer on DRAMs. Dynamic RAM: Technology Advancements provides a holistic view of the DRAM technology with a systematic description of the advancements in the field since the 1970s, and an analysis of future challenges. Topics Include: DRAM cells of all types, including planar, three-dimensional (3-D) trench or stacked, COB or CUB, vertical, and mechanically robust cells using advanced transistors and storage capacitors Advancements in transistor technology for the RCAT, SCAT, FinFET, BT FinFET, Saddle and advanced recess type, and storage capacitor realizations How sub 100 nm trench DRAM technologies and sub 50 nm stacked DRAM technologies and related topics may lead to new research Various types of leakages and power consumption reduction methods in active and sleep mode Various types of SAs and yield enhancement techniques employing ECC and redundancy A worthwhile addition to semiconductor memory research, academicians and researchers interested in the design and optimization of high-density and cost-efficient DRAMs may also find it useful as part of a graduate-level course.