Materials Reliability in Microelectronics II: Volume 265
Title | Materials Reliability in Microelectronics II: Volume 265 PDF eBook |
Author | C. V. Thompson |
Publisher | |
Pages | 352 |
Release | 1992-09-30 |
Genre | Technology & Engineering |
ISBN |
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Materials Reliability in Microelectronics, II
Title | Materials Reliability in Microelectronics, II PDF eBook |
Author | Carl V. Thompson |
Publisher | |
Pages | 328 |
Release | 1992 |
Genre | |
ISBN |
Materials Reliability in Microelectronics
Title | Materials Reliability in Microelectronics PDF eBook |
Author | |
Publisher | |
Pages | 488 |
Release | 1997 |
Genre | Microelectronics |
ISBN |
Materials Reliability in Microelectronics IV
Title | Materials Reliability in Microelectronics IV PDF eBook |
Author | Materials Research Society |
Publisher | Materials Research Society |
Pages | |
Release | 1994-01-01 |
Genre | Technology & Engineering |
ISBN | 9783380000006 |
Materials Reliability in Microelectronics
Title | Materials Reliability in Microelectronics PDF eBook |
Author | |
Publisher | |
Pages | 392 |
Release | 1999 |
Genre | Microelectronics |
ISBN |
Materials Reliability Issues in Microelectronics
Title | Materials Reliability Issues in Microelectronics PDF eBook |
Author | |
Publisher | |
Pages | 392 |
Release | 1991 |
Genre | Microelectronics |
ISBN |
Proceedings of the "MRS Symposium on Materials Reliability Issues in Microelectronics"--Dedication, p. xiii.
Materials Reliability in Microelectronics V: Volume 391
Title | Materials Reliability in Microelectronics V: Volume 391 PDF eBook |
Author | Anthony S. Oates |
Publisher | |
Pages | 552 |
Release | 1995-10-24 |
Genre | Technology & Engineering |
ISBN |
This long-standing proceedings series is highly regarded as a premier forum for the discussion of microelectronics reliability issues. In this fifth book, emphasis is on the fundamental understanding of failure phenomena in thin-film materials. Special attention is given to electromigration and mechanical stress effects. The reliability of thin dielectrics and hot carrier degradation of transistors are also featured. Topics include: modeling and simulation of failure mechanisms; reliability issues for submicron IC technologies and packaging; stresses in thin films/lines; gate oxides; barrier layers; electromigration mechanisms; reliability issues for Cu metallizations; electromigration and microstructure; electromigration and stress voiding in circuit interconnects; and resistance measurements of electromigration damage.