This book provides complete step-by-step guidance on the physical implementation of modern integrated circuits, showing you their limitations and guiding you through their common remedies. The book describes today’s manufacturing techniques and how they impact design rules. You will understand how to build common high frequency devices such as inductors, capacitors and T-coils, and will also learn strategies for dealing with high-speed routing both on package level and on-chip applications. Numerous algorithms implemented in Python are provided to guide you through how extraction, netlist comparison and design rule checkers can be built. The book also helps you unravel complexities that effect circuit design, including signal integrity, matching, IR drop, parasitic impedance and more, saving you time in addressing these effects directly. You will also find detailed descriptions of software tools used to analyze a layout database, showing you how devices can be recognized and connectivity accurately assessed. The book removes much of fog that often hides the inner workings of layout related software tools and helps you better understand: the physics of advanced nodes, high speed techniques used in modern integrated technologies, and the inner working of software used to analyze layout databases. This is an excellent resource for circuit designers implementing a schematic in a layout database, especially those involved in deep submicron designs, as well as layout designers wishing to deepen their understanding of modern layout rules.

Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization

This book covers the fundamental knowledge of layout design from the ground up, addressing both physical design, as generally applied to digital circuits, and analog layout. Such knowledge provides the critical awareness and insights a layout designer must possess to convert a structural description produced during circuit design into the physical layout used for IC/PCB fabrication. The book introduces the technological know-how to transform silicon into functional devices, to understand the technology for which a layout is targeted (Chap. 2). Using this core technology knowledge as the foundation, subsequent chapters delve deeper into specific constraints and aspects of physical design, such as interfaces, design rules and libraries (Chap. 3), design flows and models (Chap. 4), design steps (Chap. 5), analog design specifics (Chap. 6), and finally reliability measures (Chap. 7). Besides serving as a textbook for engineering students, this book is a foundational reference for today’s circuit designers. For Slides and Other Information: https://www.ifte.de/books/pd/index.html

Learn the principles and practices of simulation-based analog IC design This comprehensive textbook and on-the-job reference offers clear instruction on analog integrated circuit design using the latest simulation techniques. Ideal for graduate students and professionals alike, the book shows, step by step, how to develop and deploy integrated circuits for cutting-edge Internet of Things (IoT) and other applications. Analog Integrated Circuit Design by Simulation: Techniques, Tools, and Methods lays out practical, ready-to-apply engineering strategies. Application layer, device layer, and circuit layer IC design are covered in complete detail. You will learn how to tackle real-world design problems and avoid long cycles of trial and error. Coverage includes: First-order DC response Unified closed-loop model Accurate modeling of DC response Frequency and step response Multi-pole dynamic response and stability Effect of external network on differential gain Continuous-time and discrete-time amplifiers MOSFET, NMOS, and PMOS characteristics Small-signal modeling and circuit analysis Resistor and capacitor design Current sources, sinks, and mirrors Basic, symmetrical, folded-cascode, and Miller OTAs Opamps with source-follower and common-source output stages Fully differential OTAs and opamps

Learn how analog circuit simulators work with these easy to use numerical recipes implemented in the popular Python programming environment. This book covers the fundamental aspects of common simulation analysis techniques and algorithms used in professional simulators today in a pedagogical way through simple examples. The book covers not just linear analyses but also nonlinear ones like steady state simulations. It is rich with examples and exercises and many figures to help illustrate the points. For the interested reader, the fundamental mathematical theorems governing the simulation implementations are covered in the appendices. Demonstrates circuit simulation algorithms through actual working code, enabling readers to build an intuitive understanding of what are the strengths and weaknesses with various methods Provides details of all common, modern circuit simulation methods in one source Provides Python code for simulations via download Includes transistor numerical modeling techniques, based on simplified transistor physics Provides detailed mathematics and ample references in appendices

A practical guide to the effects of radiation on semiconductor components of electronic systems, and techniques for the designing, laying out, and testing of hardened integrated circuits This book teaches the fundamentals of radiation environments and their effects on electronic components, as well as how to design, lay out, and test cost-effective hardened semiconductor chips not only for today’s space systems but for commercial terrestrial applications as well. It provides a historical perspective, the fundamental science of radiation, and the basics of semiconductors, as well as radiation-induced failure mechanisms in semiconductor chips. Integrated Circuits Design for Radiation Environments starts by introducing readers to semiconductors and radiation environments (including space, atmospheric, and terrestrial environments) followed by circuit design and layout. The book introduces radiation effects phenomena including single-event effects, total ionizing dose damage and displacement damage) and shows how technological solutions can address both phenomena. Describes the fundamentals of radiation environments and their effects on electronic components Teaches readers how to design, lay out and test cost-effective hardened semiconductor chips for space systems and commercial terrestrial applications Covers natural and man-made radiation environments, space systems and commercial terrestrial applications Provides up-to-date coverage of state-of-the-art of radiation hardening technology in one concise volume Includes questions and answers for the reader to test their knowledge Integrated Circuits Design for Radiation Environments will appeal to researchers and product developers in the semiconductor, space, and defense industries, as well as electronic engineers in the medical field. The book is also helpful for system, layout, process, device, reliability, applications, ESD, latchup and circuit design semiconductor engineers, along with anyone involved in micro-electronics used in harsh environments.

This book introduces readers to a variety of tools for analog layout design automation. After discussing the placement and routing problem in electronic design automation (EDA), the authors overview a variety of automatic layout generation tools, as well as the most recent advances in analog layout-aware circuit sizing. The discussion includes different methods for automatic placement (a template-based Placer and an optimization-based Placer), a fully-automatic Router and an empirical-based Parasitic Extractor. The concepts and algorithms of all the modules are thoroughly described, enabling readers to reproduce the methodologies, improve the quality of their designs, or use them as starting point for a new tool. All the methods described are applied to practical examples for a 130nm design process, as well as placement and routing benchmark sets.