Honeycomb Technology is a guide to honeycomb cores and honeycomb sandwich panels, from the manufacturing methods by which they are produced, to the different types of design, applications for usage and methods of testing the materials. It explains the different types of honeycomb cores available and provides tabulated data of their properties. The author has been involved in the testing and design of honeycomb cores and sandwich panels for nearly 30 years. Honeycomb Technology reflects this by emphasizing a `hands-on' approach and discusses procedures for designing sandwich panels, explaining the necessary equations. Also included is a section on how to design honeycomb energy absorbers and one full chapter discussing honeycomb core and sandwich panel testing. Honeycomb Technology will be of interest to engineers in the aircraft, aerospace and building industries. It will also be of great use to engineering students interested in basic sandwich panel design.

Honeycomb Technology is a guide to honeycomb cores and honeycomb sandwich panels, from the manufacturing methods by which they are produced, to the different types of design, applications for usage and methods of testing the materials. It explains the different types of honeycomb cores available and provides tabulated data of their properties. The author has been involved in the testing and design of honeycomb cores and sandwich panels for nearly 30 years. Honeycomb Technology reflects this by emphasizing a `hands-on' approach and discusses procedures for designing sandwich panels, explaining the necessary equations. Also included is a section on how to design honeycomb energy absorbers and one full chapter discussing honeycomb core and sandwich panel testing. Honeycomb Technology will be of interest to engineers in the aircraft, aerospace and building industries. It will also be of great use to engineering students interested in basic sandwich panel design.

The rapidly-expanding aerospace industry is a prime developer and user of advanced metallic and composite materials in its many products. This book concentrates on the manufacturing technology necessary to fabricate and assemble these materials into useful and effective structural components. Detailed chapters are dedicated to each key metal or alloy used in the industry, including aluminum, magnesium, beryllium, titanium, high strength steels, and superalloys. In addition the book deals with composites, adhesive bonding and presents the essentials of structural assembly. This book will be an important resource for all those involved in aerospace design and construction, materials science and engineering, as well as for metallurgists and those working in related sectors such as the automotive and mass transport industries. Flake Campbell Jr has over thirty seven years experience in the aerospace industry and is currently Senior Technical Fellow at the Boeing Phantom Works in Missouri, USA.* All major aerospace structural materials covered: metals and composites* Focus on details of manufacture and use* Author has huge experience in aerospace industry* A must-have book for materials engineers, design and structural engineers, metallurgical engineers and manufacturers for the aerospace industry

This book includes a selection of reviewed papers presented at the 2015, 4th China Academic Conference on Printing and Packaging, which was held on October 22-24, 2015 in Hangzhou, China. The conference was jointly organized by the China Academy of Printing Technology, Beijing Institute of Graphic Communication, and Hangzhou Dianzi University. With 3 keynote talks and 200 presented papers on graphic communications, packaging technologies and materials, the conference attracted more than 400 scientists. These proceedings cover the recent research outcomes on color science and technology, image-processing technology, digital-media technology, printing-engineering technology, packaging-engineering technology etc. They will be of interest to university researchers, R&D engineers and graduate students in graphic communications, packaging, color science, image science, materials science, computer science, digital media and network technology fields.