A number of fundamental topics in the field of high performance clock distribution networks is covered in this book. High Performance Clock Distribution Networks is composed of ten contributions from authors at academic and industrial institutions. Topically, these contributions can be grouped within three primary areas. The first topic area deals with exploiting the localized nature of clock skew. The second topic area deals with the implementation of these clock distribution networks, while the third topic area considers more long-range aspects of next-generation clock distribution networks. High Performance Clock Distribution Networks presents a number of interesting strategies for designing and building high performance clock distribution networks. Many aspects of the ideas presented in these contributions are being developed and applied today in next-generation high-performance microprocessors.

High-Speed Clock Network Design is a collection of design concepts, techniques and research works from the author for clock distribution in microprocessors and high-performance chips. It is organized in 11 chapters.

The appropriate interconnect model has changed several times over the past two decades due to the application of aggressive technology scaling. New, more accurate interconnect models are required to manage the changing physical characteristics of integrated circuits. Currently, RC models are used to analyze high resistance nets while capacitive models are used for less resistive interconnect. However, on-chip inductance is becoming more important with integrated circuits operating at higher frequencies, since the inductive impedance is proportional to the frequency. The operating frequencies of integrated circuits have increased dramatically over the past decade and are expected to maintain the same rate of increase over the next decade, approaching 10 GHz by the year 2012. Also, wide wires are frequently encountered in important global nets, such as clock distribution networks and in upper metal layers, and performance requirements are pushing the introduction of new materials for low resistance interconnect, such as copper interconnect already used in many commercial CMOS technologies. On-Chip Inductance in High Speed Integrated Circuits deals with the design and analysis of integrated circuits with a specific focus on on-chip inductance effects. It has been described throughout this book that inductance can have a tangible effect on current high speed integrated circuits. For example, neglecting inductance and using an RC interconnect model in a production 0.25 mum CMOS technology can cause large errors (over 35%) in estimates of the propagation delay of on-chip interconnect. It has also been shown that including inductance in the repeater insertion design process as compared to using an RC model improves the overall repeater solution in terms of area, power, and delay with average savings of 40.8%, 15.6%, and 6.7%, respectively. On-Chip Inductance in High Speed Integrated Circuits is full of design and analysis techniques for RLC interconnect. These techniques are compared to techniques traditionally used for RC interconnect design to emphasize the effect of inductance. emOn-Chip Inductance in High Speed Integrated Circuits will be of interest to researchers in the area of high frequency interconnect, noise, and high performance integrated circuit design.

Distributing power in high speed, high complexity integrated circuits has become a challenging task as power levels exceeding tens of watts have become commonplace while the power supply is plunging toward one volt. This book is dedicated to this important subject. The primary purpose of this monograph is to provide insight and intuition into the behavior and design of power distribution systems for high speed, high complexity integrated circuits.

Provides the only up-to-date source on the most recent advances in this often complex and fascinating topic. The only book to be entirely devoted to clocking Clocking has become one of the most important topics in the field of digital system design A "must have" book for advanced circuit engineers

"This comprehensive collection of papers offers you practical information that can be used to develop high-performance digital system design. Specially written introductions by editor Vojin G. Oklobdzija precede each chapter to aid your understanding of the most relevant topics in this advanced area of circuit design. Featured topics include: * Differential pass-transistor logic * High-speed circuits and design of high-performance systems * Advanced deep submicron circuits used in high-speed computers and digital circuits * Clocking and latch design essential to high-performance systems * Relationships between VLSI algorithms and implementation techniques HIGH PERFORMANCE SYSTEM DESIGN: Circuits and Logic is indispensable reading for circuit designers, practicing engineers, and students who want to master the basic principles underlying high-performance system design. This handy, single volume provides a useful reference to a collection of accumulated experience necessary for good, successful designs. Professors: To request an examination copy simply e-mail [email protected]." Sponsored by: IEEE Solid-State Circuits Council/Society.

This book describes methods for distributing power in high speed, high complexity integrated circuits with power levels exceeding many tens of watts and power supplies below a volt. It provides a broad and cohesive treatment of power distribution systems and related design problems, including both circuit network models and design techniques for on-chip decoupling capacitors, providing insight and intuition into the behavior and design of on-chip power distribution systems. Organized into subareas to provide a more intuitive flow to the reader, this second edition adds more than a hundred pages of new content, including inductance models for interdigitated structures, design strategies for multi-layer power grids, advanced methods for efficient power grid design and analysis, and methodologies for simultaneously placing on-chip multiple power supplies and decoupling capacitors. The emphasis of this additional material is on managing the complexity of on-chip power distribution networks.