With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This new book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume. The authors present a comprehensive convective heat transfer catalog that includes correlations of heat transfer for various physical configurations and thermal boundary conditions. They also provide property tables of solids and fluids. Lian-Tuu Yeh and Richard Chu are recognized experts in the field of thermal management of electronic systems and have a combined 60 years of experience in the defense and commercial industries.

A total of 2519 annotated references to the unclassified report literature is presented. Subjects covered under heat transfer and fluid flow include radioinduced heating; boiling; boiler, evaporators, pump, and heat exchanger design; hydrodynamics; coolants and their properties; thermal and flow instrumentation; high temperature materials; thermal properties of materials; and thermal insulation. Subjects covered less completely include thermodynamics; aerodynamics; high temperature corrosion; corrosion specific to heat transfer systems; erosion; mass transfer; corrosion film formation and effects; coolant processing and radioactivity; radiation effects of heat transfer materials; and pertinent data of thermonuclear processes. Subject, report number availability, and author indexes are given.