Provides an essential introduction to modeling terrestrial ecosystems in Earth system models for graduate students and researchers.

Heat and Mass Transfer in Capillary-Porous Bodies describes the modern theory of heat and mass transfer on the basis of the thermodynamics of irreversible processes. This book provides a systematic account of the phenomena of heat and mass transfer in capillary-porous bodies. Organized into 10 chapters, this book begins with an overview of the processes of the transfer of heat and mass of a substance. This text then examines the application of the theory to the investigation of heat and mass exchange in walls and in technological processes for the manufacture of building materials. Other chapters consider the thermal properties of building materials by using the methods of the thermodynamics of mass transfer. The final chapter deals with the method of finite differences, which is applicable to the solution of problems of non-steady heat conduction. This book is a valuable resource for scientists, post-graduate students, engineers, and students in higher educational establishments for architectural engineering.

This Brief deals with electrode design and placement, enhancement of both liquid and gas flow, vapor space condensation, in-tube condensation, falling film evaporation, correlations. It further provides a fundamental understanding of boiling and condensation, pool boiling, critical heat flux, convective vaporization, additives for single-phase liquids like solid particles, gas bubbles, suspensions in dilute polymer and surfactant solutions, solid additives and liquid additives for gases, additives for boiling, condensation and absorption, mass transfer resistance in gas phase (condensation with noncondensible gases, evaporation into air, dehumidifying finned tube heat exchangers, water film enhancement of finned tube exchanger), controlling resistance in liquid phase, and significant resistance in both phases. The volume is ideal for professionals and researchers dealing with thermal management in devices.