With speeds of up to 20 gigabits per second and the ability to support up to one million devices per square kilometer, 5G — the current generation of mobile communications technology — may seem impressive, but 6G is set to take these capabilities even further. Envisioned to deliver a peak data rate of 1 terabit per second and latency of 100 microseconds or less, 6G must be able to seamlessly and securely deliver data in an ever increasingly saturated network of wireless connections without exceeding the energy requirements of 5G.This book covers every aspect of future communications, from key technologies, to design challenges, network requirements, and users experiences; to standardization, chip design, and industry applications from 5G to 6G. It presents the requirements and use cases of 6G, RF transceivers roadmap for 2030 and beyond, and modeling of RF devices for 5G/6G applications. In here, a modified Shannon's capacity formula that is critical for future advanced wireless communications such as 6G is discussed for the first time. It also presents the standardization of 6G wireless communication systems with emphasis on Standard Development Organizations (SDOs), regulatory bodies and administrations, ITU, industry forums, and 6G standard timeline. The book presents an RF/mm-wave integrated circuit design for future communications to provides readers with an easy-to-understand overview of voltage-controlled oscillators, power amplifiers, low-noise amplifiers, frequency synthesizers, high-frequency dividers, and chip-to-chip communications isolation technology.This book is an excellent reference for readers specializing in electrical and electronic engineering, wireless communication, integrated circuit design, circuits and systems, to learn more about 5G and even 6G communication standards and RF/mm-wave IC design. In particular, professionals working in the foundry, fabless semiconductor companies, original equipment manufacturers, and integrated device manufacturers will also benefit from this book.

"With speeds of up to 20-gigabits per second and the ability to support up to one million devices per square kilometer, 5G - the current generation of mobile communications technology - may seem impressive, but 6G is set to take these capabilities even further. Envisioned to deliver a peak data rate of 1 Terabit per second and latency of 100 microseconds or less, 6G must be able to seamlessly and securely deliver data in an ever increasingly saturated network of wireless connections without exceeding the energy requirements of 5G. This book covers every aspect of future communication from key technologies, to design challenges, network requirements and users' experiences to standardization, chip design, and industry applications from 5G to 6G. It presents the requirements and use cases of 6G, RF transceivers roadmap for 2030 and beyond, and modelling of RF devices for 5G/6G applications. In here, a modified Shannon's capacity formula that is critical for future advanced wireless communication such as 6G is discussed for the first time. It also presents the standardization of 6G wireless communication systems with emphasis on Standard Development Organizations (SDOs), regulatory bodies and administrations, ITU, industry forums, and 6G standard timeline. The book presents RF/mm-wave integrated circuit design for future communications to provides readers with an easy-to-understand overview of voltage-controlled oscillators, power amplifiers, low-noise amplifiers, frequency synthesizers, high-frequency dividers, and chip-to-chip communications isolation technology. This book is an excellent reference for readers specializing in electrical & electronic engineering, wireless communication, integrated circuit design, circuits and systems, to learn more about the 5G and even 6G communication standards, and RF/mm-wave IC design. In particularly, professionals working in the foundry, fabless semiconductor company, original equipment manufacturer and integrated device manufacturer will also benefit from this book"--

Tactile Internet with Human-in-the-Loop describes the change from the current Internet, which focuses on the democratization of information independent of location or time, to the Tactile Internet, which democratizes skills to promote equity that is independent of age, gender, sociocultural background or physical limitations. The book promotes the concept of the Tactile Internet for remote closed-loop human-machine interaction and describes the main challenges and key technologies. Current standardization activities in the field for IEEE and IETF are also described, making this book an ideal resource for researchers, graduate students, and industry R&D engineers in communications engineering, electronic engineering, and computer engineering. - Provides a comprehensive reference that addresses all aspects of the Tactile Internet – technologies, engineering challenges, use cases and standards - Written by leading researchers in the field - Presents current standardizations surrounding the IETF and the IEEE - Contains use cases that illustrate practical applications

Multiple-input, multiple-output (MIMO), which transmits multiple data streams via multiple antenna elements, is one of the most attractive technologies in the wireless communication field. Its extension, called ‘massive MIMO’ or ‘large-scale MIMO’, in which base station has over one hundred of the antenna elements, is now seen as a promising candidate to realize 5G and beyond, as well as 6G mobile communications. It has been the first decade since its fundamental concept emerged. This Special Issue consists of 19 papers and each of them focuses on a popular topic related to massive MIMO systems, e.g. analog/digital hybrid signal processing, antenna fabrication, and machine learning incorporation. These achievements could boost its realization and deepen the academic and industrial knowledge of this field.

Integrated Sensing and Communications for Future Wireless Networks: Principles, Advances and Key Enabling Technologies presents the principles, methods, and algorithms of ISAC, an overview of the essential enabling technologies, as well as the latest research and future directions. Suitable for academic researchers and post graduate students as well as industry R&D engineers, this book is the definitive reference in this interdisciplinary field that is being seen as a technology to enable emerging applications such as vehicular networks, environmental monitoring, remote sensing, IoT, smart cities. Importantly, ISAC has been identified as an enabling technology for B5G/6G, and the next-generation Wi-Fi system. ISAC brings together a range of technologies: radar sensing, reconfigurable intelligent surfaces, holographic surfaces through to high frequency terahertz, PHY security, channel signaling, multiple access, and machine learning. - Gives an overview of ISAC technology – its potential, the challenges and future research trajectory - Presents the future directions of ISAC - Includes discussion of the following technologies: i. Intelligent Metasurfaces for ISAC; ii. Machine Learning and AI for ISAC; iii. ISAC Waveform Design and Full-Duplex; iv. Millimeter Wave, Terahertz, and Beamforming for ISAC; v. Network Architectural Aspects of Integrating Sensing

This book describes the fundamentals of THz communications, spanning the whole range of applications, propagation and channel models, RF transceiver technology, antennas, baseband techniques, and networking interfaces. The requested data rate in wireless communications will soon reach from 100 Gbit/s up to 1 Tbps necessitating systems with ultra-high bandwidths of several 10s of GHz which are available only above 200 GHz. In the last decade, research at these frequency bands has made significant progress, enabling mature experimental demonstrations of so-called THz communications, which are thus expected to play a vital role in future wireless networks. In addition to chapters by leading experts on the theory, modeling, and implementation of THz communication technology, the book also features the latest experimental results and addresses standardization and regulatory aspects. This book will be of interest to both academic researchers and engineers in the telecommunications industry.