Silicon sensors with a three-dimensional (3-D) architecture, in which the n and p electrodes penetrate through the entire substrate, have many advantages over planar silicon sensors including radiation hardness, fast time response, active edge and dual readout capabilities. The fabrication of 3D sensors is however rather complex. In recent years, there have been worldwide activities on 3D fabrication. SINTEF in collaboration with Stanford Nanofabrication Facility have successfully fabricated the original (single sided double column type) 3D detectors in two prototype runs and the third run is now on-going. This paper reports the status of this fabrication work and the resulted yield. The work of other groups such as the development of double sided 3D detectors is also briefly reported.

Written by the leading names in this field, this book introduces the technical properties, design and fabrication details, measurement results, and applications of three-dimensional silicon radiation sensors. Such devices are currently used in the ATLAS experiment at the European Centre for Particle Physics (CERN) for particle tracking in high energy physics. These sensors are the radiation hardest devices ever fabricated and have applications in ground-breaking research in neutron detection, medical dosimetry and space technologies and more. Chapters explore the essential features of silicon particle detectors, interactions of radiation with matter, radiation damage effects, and micro-fabrication, in addition to a providing historical overview of the field. This book will be a key reference for students and researchers working with sensor technologies. Features: The first book dedicated to this unique and growing subject area, which is also widely applicable in high-energy physics, medical physics, space science and beyond Authored by Sherwood Parker, the inventor of the concept of 3D detectors; Cinzia Da Vià, who has brought 3DSi technology to application; and Gian-Franco Dalla Betta, a leading figure in the design and fabrication technology of these devices Explains to non-experts the essential features of silicon particle detectors, interactions of radiation with matter, radiation damage effects, and micro-fabrication

Development of 3D silicon radiation sensors employing electrodes fabricated perpendicular to the sensor surfaces to improve fabrication yields and increasing pulse speeds.

Written by the leading names in this field, this book introduces the technical properties, design and fabrication details, measurement results, and applications of three-dimensional silicon radiation sensors. Such devices are currently used in the ATLAS experiment at the European Centre for Particle Physics (CERN) for particle tracking in high energy physics. These sensors are the radiation hardest devices ever fabricated and have applications in ground-breaking research in neutron detection, medical dosimetry and space technologies and more. Chapters explore the essential features of silicon particle detectors, interactions of radiation with matter, radiation damage effects, and micro-fabrication, in addition to a providing historical overview of the field. This book will be a key reference for students and researchers working with sensor technologies. Features: The first book dedicated to this unique and growing subject area, which is also widely applicable in high-energy physics, medical physics, space science and beyond Authored by Sherwood Parker, the inventor of the concept of 3D detectors; Cinzia Da Vià, who has brought 3DSi technology to application; and Gian-Franco Dalla Betta, a leading figure in the design and fabrication technology of these devices Explains to non-experts the essential features of silicon particle detectors, interactions of radiation with matter, radiation damage effects, and micro-fabrication

This book begins by introducing new and unique fabrication, micromachining, and integration manufacturing methods for MEMS (Micro-Electro-Mechanical Systems) and NEMS (Nano-Electro-Mechanical Systems) devices, as well as novel nanomaterials for sensor fabrications. The second section focuses on novel sensors based on these emerging MEMS/NEMS fabrication methods, and their related applications in industrial, biomedical, and environmental monitoring fields, which makes up the sensing layer (or perception layer) in IoT architecture. This authoritative guide offers graduate students, postgraduates, researchers, and practicing engineers with state-of-the-art processes and cutting-edge technologies on MEMS /NEMS, micro- and nanomachining, and microsensors, addressing progress in the field and prospects for future development. Presents latest international research on MEMS/NEMS fabrication technologies and novel micro/nano sensors; Covers a broad spectrum of sensor applications; Written by leading experts in the field.

A comprehensive guide to MEMS materials, technologies and manufacturing, examining the state of the art with a particular emphasis on current and future applications. Key topics covered include: Silicon as MEMS material Material properties and measurement techniques Analytical methods used in materials characterization Modeling in MEMS Measuring MEMS Micromachining technologies in MEMS Encapsulation of MEMS components Emerging process technologies, including ALD and porous silicon Written by 73 world class MEMS contributors from around the globe, this volume covers materials selection as well as the most important process steps in bulk micromachining, fulfilling the needs of device design engineers and process or development engineers working in manufacturing processes. It also provides a comprehensive reference for the industrial R&D and academic communities. Veikko Lindroos is Professor of Physical Metallurgy and Materials Science at Helsinki University of Technology, Finland. Markku Tilli is Senior Vice President of Research at Okmetic, Vantaa, Finland. Ari Lehto is Professor of Silicon Technology at Helsinki University of Technology, Finland. Teruaki Motooka is Professor at the Department of Materials Science and Engineering, Kyushu University, Japan. Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques Shows how to protect devices from the environment and decrease package size for dramatic reduction of packaging costs Discusses properties, preparation, and growth of silicon crystals and wafers Explains the many properties (mechanical, electrostatic, optical, etc), manufacturing, processing, measuring (incl. focused beam techniques), and multiscale modeling methods of MEMS structures

Microelectromechanical systems (MEMS) have had a profound impact on a wide range of applications. The degree of miniaturization made possible by MEMS technology has significantly improved the functionalities of many systems, and the performance of MEMS has steadily improved as its uses augment. Notably, MEMS sensors have been prevalent in motion sensing applications for decades, and the sensing mechanisms leveraged by MEMS have been continuously extended to applications spanning the detection of gases, magnetic fields, electromagnetic radiation, and more. In parallel, MEMS resonators have become an emerging field of MEMS and affected subfields such as electronic timing and filtering, and energy harvesting. They have, in addition, enabled a wide range of resonant sensors. For many years now, MEMS have been the basis of various industrial successes, often building on novel academic research. Accordingly, this Special Issue explores many research innovations in MEMS sensors and resonators, from biomedical applications to energy harvesting, gas sensing, resonant sensing, and timing.