The book is aimed at assessing the capabilities of state-of-the-art optical techniques in elucidating the fundamental electronic and structural properties of semiconductor and metal surfaces, interfaces, thin layers, and layer structures, and assessing the usefulness of these techniques for optimization of high quality multilayer samples through feedback control during materials growth and processing. Particular emphasis is placed on the theory of non-linear optics and dynamical processes through the use of pump-probe techniques together with the search for new optical sources. Some new applications of Scanning Probe Microscopy to Material science and biological samples, dried and in vivo, with the use of different laser sources are also presented. Materials of special interest are silicon, semiconductor-metal interfaces, semiconductor and magnetic multi-layers and III-V compound semiconductors.

The book is aimed at assessing the capabilities of state-of-the-art optical techniques in elucidating the fundamental electronic and structural properties of semiconductor and metal surfaces, interfaces, thin layers, and layer structures, and assessing the usefulness of these techniques for optimization of high quality multilayer samples through feedback control during materials growth and processing. Particular emphasis is placed on the theory of non-linear optics and dynamical processes through the use of pump-probe techniques together with the search for new optical sources. Some new applications of Scanning Probe Microscopy to Material science and biological samples, dried and in vivo, with the use of different laser sources are also presented. Materials of special interest are silicon, semiconductor-metal interfaces, semiconductor and magnetic multi-layers and III-V compound semiconductors.

The book is aimed at assessing the capabilities of state-of-the-art optical techniques in elucidating the fundamental electronic and structural properties of semiconductor and metal surfaces, interfaces, thin layers, and layer structures, and assessing the usefulness of these techniques for optimization of high quality multilayer samples through feedback control during materials growth and processing. Particular emphasis is dedicated to the theory of nonlinear optics and to dynamical processes through the use of pump-probe techniques together with the search for new optical sources. Some new applications of Scanning Probe Microscopy to Material Science and biological samples, dried and in vivo, with the use of different laser sources are also presented. Materials of particular interest are silicon, semiconductor-metal interfaces, semiconductor and magnetic multi-layers and III-V compound semiconductors.

A practical guide to semiconductor manufacturing from processcontrol to yield modeling and experimental design Fundamentals of Semiconductor Manufacturing and Process Controlcovers all issues involved in manufacturing microelectronic devicesand circuits, including fabrication sequences, process control,experimental design, process modeling, yield modeling, and CIM/CAMsystems. Readers are introduced to both the theory and practice ofall basic manufacturing concepts. Following an overview of manufacturing and technology, the textexplores process monitoring methods, including those that focus onproduct wafers and those that focus on the equipment used toproduce wafers. Next, the text sets forth some fundamentals ofstatistics and yield modeling, which set the foundation for adetailed discussion of how statistical process control is used toanalyze quality and improve yields. The discussion of statistical experimental design offers readers apowerful approach for systematically varying controllable processconditions and determining their impact on output parameters thatmeasure quality. The authors introduce process modeling concepts,including several advanced process control topics such asrun-by-run, supervisory control, and process and equipmentdiagnosis. Critical coverage includes the following: * Combines process control and semiconductor manufacturing * Unique treatment of system and software technology and managementof overall manufacturing systems * Chapters include case studies, sample problems, and suggestedexercises * Instructor support includes electronic copies of the figures andan instructor's manual Graduate-level students and industrial practitioners will benefitfrom the detailed exami?nation of how electronic materials andsupplies are converted into finished integrated circuits andelectronic products in a high-volume manufacturingenvironment. An Instructor's Manual presenting detailed solutions to all theproblems in the book is available from the Wiley editorialdepartment. An Instructor Support FTP site is also available.

This Dictionary covers information and communication technology (ICT), including hardware and software; information networks, including the Internet and the World Wide Web; automatic control; and ICT-related computer-aided fields. The Dictionary also lists abbreviated names of relevant organizations, conferences, symposia and workshops. This reference is important for all practitioners and users in the areas mentioned above, and those who consult or write technical material. This Second Edition contains 10,000 new entries, for a total of 33,000.

"This concise introduction to semiconductor fabrication technology covers everything professionals need to know, from crystal growth to integrated devices and circuits. Throughout, the authors address both theory and the practical aspects of each major fabrication step, including crystal growth, silicon oxidation, photolithography, etching, diffusion, ion implantation, and thin film deposition. The book integrates Computer Modeling & Simulation tools throughout. Process simulation is used as a tool for what-if analysis and discussion. Comprehensive coverage of process sequence helps readers connect individual steps into a cohesive whole."--

Gathering research from physics, mechanical engineering, and statistics in a single resource for the first time, this text presents the background to the model, its theoretical basis, and applications ranging from materials science to earth science. The authors start by explaining why disorder is important for fracture and then go on to introduce the fiber bundle model, backed by various different applications. Appendices present the necessary mathematical, computational and statistical background required. The structure of the book allows the reader to skip some material that is too specialized, making this topic accessible to the engineering, mechanics and materials science communities, in addition to providing further reading for graduate students in statistical physics.