The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory bandwidth for future chip-multiprocessor design, mitigating the "memory wall" problem. In addition, heterogenous integration enabled by 3D technology can also result in innovative designs for future microprocessors. This book first provides a brief introduction to this emerging technology, and then presents a variety of approaches to designing future 3D microprocessor systems, by leveraging the benefits of low latency, high bandwidth, and heterogeneous integration capability which are offered by 3D technology.

This book summarizes the landscape of cache replacement policies for CPU data caches. The emphasis is on algorithmic issues, so the authors start by defining a taxonomy that places previous policies into two broad categories, which they refer to as coarse-grained and fine-grained policies. Each of these categories is then divided into three subcategories that describe different approaches to solving the cache replacement problem, along with summaries of significant work in each category. Richer factors, including solutions that optimize for metrics beyond cache miss rates, that are tailored to multi-core settings, that consider interactions with prefetchers, and that consider new memory technologies, are then explored. The book concludes by discussing trends and challenges for future work. This book, which assumes that readers will have a basic understanding of computer architecture and caches, will be useful to academics and practitioners across the field.

Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.

3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.

The two-volume set LNCS 12415 and 12416 constitutes the refereed proceedings of of the 19th International Conference on Artificial Intelligence and Soft Computing, ICAISC 2020, held in Zakopane, Poland*, in October 2020. The 112 revised full papers presented were carefully reviewed and selected from 265 submissions. The papers included in the first volume are organized in the following six parts: ​neural networks and their applications; fuzzy systems and their applications; evolutionary algorithms and their applications; pattern classification; bioinformatics, biometrics and medical applications; artificial intelligence in modeling and simulation. The papers included in the second volume are organized in the following four parts: computer vision, image and speech analysis; data mining; various problems of artificial intelligence; agent systems, robotics and control. *The conference was held virtually due to the COVID-19 pandemic.

This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.

An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and Minitab Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail Provides chapter-wise review questions and powerpoint slides as teaching tools