Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Inter-level Dielectrics
Title | Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Inter-level Dielectrics PDF eBook |
Author | G. Mathad |
Publisher | The Electrochemical Society |
Pages | 71 |
Release | 2009-03 |
Genre | Science |
ISBN | 1566776937 |
The papers included in this issue of ECS Transactions were originally presented in the symposium ¿Low k Inter-Level Metal Dielectrics and New Contact and Barrier Metallurgies/Structures¿, held during the PRiME 2008 joint international meeting of The Electrochemical Society and The Electrochemical Society of Japan, with the technical cosponsorship of the Japan Society of Applied Physics, the Korean Electrochemical Society, the Electrochemistry Division of the Royal Australian Chemical Institute, and the Chinese Society of Electrochemistry. This meeting was held in Honolulu, Hawaii, from October 12 to 17, 2008.
Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics
Title | Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics PDF eBook |
Author | G. S. Mathad |
Publisher | The Electrochemical Society |
Pages | 262 |
Release | 2001 |
Genre | Science |
ISBN | 9781566772945 |
Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics II
Title | Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics II PDF eBook |
Author | G. S. Mathad |
Publisher | The Electrochemical Society |
Pages | 290 |
Release | 2003 |
Genre | Science |
ISBN | 9781566773904 |
Copper Interconnects, New Contact Metallurgies/structures, and Low-k Inter-level Dielectrics
Title | Copper Interconnects, New Contact Metallurgies/structures, and Low-k Inter-level Dielectrics PDF eBook |
Author | Electrochemical Society |
Publisher | |
Pages | 61 |
Release | 2008 |
Genre | Technology & Engineering |
ISBN | 9781615672936 |
Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics
Title | Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics PDF eBook |
Author | |
Publisher | The Electrochemical Society |
Pages | 364 |
Release | 2003 |
Genre | Electronic packaging |
ISBN | 9781566773799 |
Copper Interconnects, New Contact and Barrier Metallurgies/structures, and Low-[kappa] Interlevel Dielectrics III
Title | Copper Interconnects, New Contact and Barrier Metallurgies/structures, and Low-[kappa] Interlevel Dielectrics III PDF eBook |
Author | G. S. Mathad |
Publisher | |
Pages | 186 |
Release | 2006 |
Genre | Dielectric films |
ISBN |
Copper Interconnect Technology
Title | Copper Interconnect Technology PDF eBook |
Author | Tapan Gupta |
Publisher | Springer Science & Business Media |
Pages | 433 |
Release | 2010-01-22 |
Genre | Technology & Engineering |
ISBN | 1441900764 |
Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated with interconnections began to influence circuit performance and will be the primary factors in the evolution of nanoscale ULSI technology. Because metallic conductivity and resistance to electromigration of bulk copper (Cu) are better than aluminum, use of copper and low-k materials is now prevalent in the international microelectronics industry. As the feature size of the Cu-lines forming interconnects is scaled, resistivity of the lines increases. At the same time electromigration and stress-induced voids due to increased current density become significant reliability issues. Although copper/low-k technology has become fairly mature, there is no single book available on the promise and challenges of these next-generation technologies. In this book, a leader in the field describes advanced laser systems with lower radiation wavelengths, photolithography materials, and mathematical modeling approaches to address the challenges of Cu-interconnect technology.