High-technology industries using plastic deformation demand soundly-based economical decisions in manufacturing design and product testing, and the unified constitutive laws of plastic deformation give researchers aguideline to use in making these decisions. This book provides extensive guidance in low cost manufacturing without the loss of product quality. Each highly detailed chapter of Unified Constitutive Laws of Plastic Deformation focuses on a distinct set of defining equations. Topics covered include anisotropic and viscoplastic flow, and the overall kinetics and thermodynamics of deformation. This important book deals with a prime topic in materials science and engineering, and will be of great use toboth researchers and graduate students. Describes the theory and applications of the constitutive law of plastic deformation for materials testing Examines the constitutive law of plastic deformation as it applies to process and product design Includes a program on disk for the determination and development of the constitutive law of plastic deformation Considers economical design and testing methods

19th Canadian Fracture Conference, Ottawa, Ontario, May 29-31, 1989

For the description of plastic deformation, a set of evolutionary rate equations is developed from deformation kinetics theory. Corresponding constitutive equations are derived for the dislocation glide mechanism, glide-plus-climb mechanism and diffusional flow. The operational equations are solved from the governing differential rate equation to determine deformation responses under different loading constraints.

19th Canadian Fracture Conference, Ottawa, Ontario, May 29-31, 1989

Materials Science and Technology A Comprehensive Treatment Edited by R.W. Cahn, P. Haasen, E.J. Kramer The 18-volume series ‘Materials Science and Technology' is the first in-depth, topic-oriented reference work devoted to this growing interdisciplinary field. A compendium of current, state-of-the-art information, it covers the most important classes of materials: metals, ceramics, glasses, polymers, semiconductors, and composites, from the fundamentals of perfect semiconductors via the physics of defects to "artificial" and amorphous semiconductors. Edited by internationally renowned figures in materials science, this series is sure to establish itself as a seminal work. Volume 6: This volume focuses on the mechanisms of plastic deformation and fatigue affecting the properties and performance of a wide variety of materials. Topics included are: flow stress and work hardening • dislocation patterning • solid solution strengthening • particle strengthening • superplasticity • inelastic deformation • cyclic deformation • fracture mechanisms • friction and wear • high-temperature deformation and creep • deformation and textures of metals at large strains

Present developments in materials science, mechanics and engineering, as well as the demands of modern technology, result in a new and growing interest in plasticity and in bordering domains of the mechanical behavior of materials. This growing interest is attested to by the success of both The International Journal of Plasticity, which after its inception rapidly became the leading journal for plasticity research, and the series ofInternational Symposia on Plasticity and Its Current Applications, which is now the premier international forum for plasticity research dissemination. The First International Symposium on Plasticity and Its Current Applications was conceived and organized by Professor Akhtar S. Khan, and was held at the University of Oklahoma (Norman, Oklahoma, USA) from July 30 to August 3, 1984. It was attended by over one hundred scientists from fifteen countries. "Plasticity '89: the Second International Symposium on Plasticity and Its Current Applications" was held at Mie University (Tsu, Japan) from July 31 to August 4, 1989; this symposium was co-chaired by Professors Khan and Tokuda. The main emphasis of this meeting was on dynamic plasticity and micromechanics, although it included other aspects of plasticity as well. It was attended by over two hundred researchers from twenty-three nations.