to increase the use of direct contact processes, the National Science Foundation sup ported a workshop on direct contact heat transfer at the Solar Energy Research Insti tute in the summer of 1985. We served as organizers for this workshop, which em phasized an area of thermal engineering that, in our opinion, has great promise for the future, but has not yet reached the point of wide-spread commercial application. Hence, a summary of the state of knowledge at this point is timely. The workshop had a dual objective: 1. To summarize the current state of knowledge in such a form that industrial practi tioners can make use of the available information. 2. To indicate the research and development needed to advance the state-of-the-art, indicating not only what kind of research is needed, but also the industrial poten tial that could be realized if the information to be obtained through the proposed research activities were available.

Since the second edition of Liquid-Vapor Phase-Change Phenomena was written, research has substantially enhanced the understanding of the effects of nanostructured surfaces, effects of microchannel and nanochannel geometries, and effects of extreme wetting on liquid-vapor phase-change processes. To cover advances in these areas, the new third edition includes significant new coverage of microchannels and nanostructures, and numerous other updates. More worked examples and numerous new problems have been added, and a complete solution manual and electronic figures for classroom projection will be available for qualified adopting professors.

Advances in Heat Transfer

The Handbook of Aluminum: Vol. 1: Physical Metallurgy and Processes covers all aspects of the physical metallurgy, analytical techniques, and processing of aluminium, including hardening, annealing, aging, property prediction, corrosion, residual stress and distortion, welding, casting, forging, molten metal processing, machining, rolling, and extrusion. It also features an extensive, chapter-length consideration of quenching.