"Integration of III-V components on Si substrates is required for realizing the promise of Silicon Photonic systems. Specifically, the direct bandgap of many III-V materials is required for light sources, efficient modulators and photodetectors. Several different approaches have been taken to integrate III-V lasers into the silicon photonic platform, such as wafer bonding, direct growth, butt coupling, etc. Here, we have devised a novel laser design that overcomes the above limitations. In our approach, we use InAs quantum dot (QD) lasers monolithically integrated with silicon waveguides and other Si photonic passive components. Due to their unique structures, the QD lasers have been proven by several groups to have the combination of high temperature stability, large modulation bandwidth and low power consumption compared with their quantum well counterparts, which makes it an ideal candidate for Si photonic applications. The first section of this dissertation introduces the theory and novelty of QD lasers, the DC and RF characterization methods of QD lasers are also discussed. The second section is focused on the growth of QD gain chip which a broadband gain chip based on QD inhomogeneous broadening properties was demonstrated. In third section, the lasers devices are built on Si substrate by Pd wafer bonding technology. Firstly, a ridge waveguide QD laser is demonstrated in this section which have better heat dissipation and lower threshold current compared to the unbonded lasers. In section four, a on Si comb laser is also developed. Due to inhomogeneous broadening and ultrafast carrier dynamics, InAs quantum dots have key advantages that make them well suited for Mode-locked lasers (MLLs). In section five, a passively mode-locked InAs quantum dots laser on Si is achieved at a repetition rate of ~7.3 GHz under appropriate bias conditions. In section six, a butt-joint integration configuration based on QD lasers and silicon photonics ring resonator is tested by using to translation stage. In order to achieve the on chip butt-joint integration, an on chip laser facet was created in section seven. A novel facet etching method is developed by using Br-ion beam assist etching (Br-IBAE). In section eight, a Pd-GaAs butt-joint integration platform was proposed, a hybrid tunable QD laser which consist of a QD SOA gain chip butt joint coupled with a passive Si3N4 photonic integrated circuit is proof of concept by using an external booster SOA coupled with a Si3N4 ring reflector feedback circuit. The final section summarized the work discussed in this thesis and also discussed some future approaches by using QD lasers integrated with silicon photonics integrated circuits based on the Pd-GaAs wafer bonding butt-joint coupled platform."--Abstract.

Future Directions in Silicon Photonics, Volume 101 in the Semiconductors and Semimetals series, highlights new advances in the field, with this updated volume presenting the latest developments as discussed by esteemed leaders in the field silicon photonics. Provides the authority and expertise of leading contributors from an international board of authors Represents the latest release in the Semiconductors and Semimetals series Includes the latest information on Silicon Photonics

Silicon Photonics, Volume 99 in the Semiconductors and Semimetals series, highlights new advances in the field, with this updated volume presenting interesting chapters on Transfer printing in Silicon Photonics, Epitaxial integration of antimonide-based semiconductor lasers on Si, Photonic crystal lasers and nanolasers on Si, the Evolution of monolithic quantum-dot light source for silicon photonics, III-V on Si nanocomposites, the Heterogeneous integration of III-V on Si by bonding, the Growth of III-V on Silicon compliant substrates and lasers by MOCVD, Photonic Integrated Circuits on Si, Integrated Photonics for Bio- and Environmental sensing, Membrane Lasers/Photodiodes on Si, and more. - Provides the authority and expertise of leading contributors from an international board of authors - Represents the latest release in the Semiconductors and Semimetals series - Updated release includes the latest information on Silicon Photonics

Silicon photonics is beginning to play an important role in driving innovations in communication and computation for an increasing number of applications, from health care and biomedical sensors to autonomous driving, datacenter networking, and security. In recent years, there has been a significant amount of effort in industry and academia to innovate, design, develop, analyze, optimize, and fabricate systems employing silicon photonics, shaping the future of not only Datacom and telecom technology but also high-performance computing and emerging computing paradigms, such as optical computing and artificial intelligence. Different from existing books in this area, Silicon Photonics for High-Performance Computing and Beyond presents a comprehensive overview of the current state-of-the-art technology and research achievements in applying silicon photonics for communication and computation. It focuses on various design, development, and integration challenges, reviews the latest advances spanning materials, devices, circuits, systems, and applications. Technical topics discussed in the book include: • Requirements and the latest advances in high-performance computing systems • Device- and system-level challenges and latest improvements to deploy silicon photonics in computing systems • Novel design solutions and design automation techniques for silicon photonic integrated circuits • Novel materials, devices, and photonic integrated circuits on silicon • Emerging computing technologies and applications based on silicon photonics Silicon Photonics for High-Performance Computing and Beyond presents a compilation of 19 outstanding contributions from academic and industry pioneers in the field. The selected contributions present insightful discussions and innovative approaches to understand current and future bottlenecks in high-performance computing systems and traditional computing platforms, and the promise of silicon photonics to address those challenges. It is ideal for researchers and engineers working in the photonics, electrical, and computer engineering industries as well as academic researchers and graduate students (M.S. and Ph.D.) in computer science and engineering, electronic and electrical engineering, applied physics, photonics, and optics.

Silicon photonics technology, which has the DNA of silicon electronics technology, promises to provide a compact photonic integration platform with high integration density, mass-producibility, and excellent cost performance. This technology has been used to develop and to integrate various photonic functions on silicon substrate. Moreover, photonics-electronics convergence based on silicon substrate is now being pursued. Thanks to these features, silicon photonics will have the potential to be a superior technology used in the construction of energy-efficient cost-effective apparatuses for various applications, such as communications, information processing, and sensing. Considering the material characteristics of silicon and difficulties in microfabrication technology, however, silicon by itself is not necessarily an ideal material. For example, silicon is not suitable for light emitting devices because it is an indirect transition material. The resolution and dynamic range of silicon-based interference devices, such as wavelength filters, are significantly limited by fabrication errors in microfabrication processes. For further performance improvement, therefore, various assisting materials, such as indium-phosphide, silicon-nitride, germanium-tin, are now being imported into silicon photonics by using various heterogeneous integration technologies, such as low-temperature film deposition and wafer/die bonding. These assisting materials and heterogeneous integration technologies would also expand the application field of silicon photonics technology. Fortunately, silicon photonics technology has superior flexibility and robustness for heterogeneous integration. Moreover, along with photonic functions, silicon photonics technology has an ability of integration of electronic functions. In other words, we are on the verge of obtaining an ultimate technology that can integrate all photonic and electronic functions on a single Si chip. This e-Book aims at covering recent developments of the silicon photonic platform and novel functionalities with heterogeneous material integrations on this platform.

This book provides guidelines and design rules for developing high-performance, low-cost, and energy-efficient quantum-dot (QD) lasers for silicon photonic integrated circuits (PIC), optical frequency comb generation, and quantum information systems. To this end, the nonlinear properties and dynamics of QD lasers on silicon are investigated in depth by both theoretical analysis and experiment. This book aims at addressing four issues encountered in developing silicon PIC: 1) The instability of laser emission caused by the chip-scale back-reflection. During photonic integration, the chip-scale back-reflection is usually responsible for the generation of severe instability (i.e., coherence collapse) from the on-chip source. As a consequence, the transmission performance of the chip could be largely degraded. To overcome this issue, we investigate the nonlinear properties and dynamics of QD laser on Si in this book to understand how can it be applied to isolator-free photonic integration in which the expensive optical isolator can be avoided. Results show that the QD laser exhibits a high degree of tolerance for chip-scale back-reflections in absence of any instability, which is a promising solution for isolator-free applications. 2) The degradation of laser performance at a high operating temperature. In this era of Internet-of-Thing (IoT), about 40% of energy is consumed for cooling in the data center. In this context, it is important to develop a high-temperature continuous-wave (CW) emitted laser source. In this book, we introduce a single-mode distributed feedback (DFB) QD laser with a design of optical wavelength detuning (OWD). By taking advantage of the OWD technique and the high-performance QD with high thermal stability, all the static and dynamical performances of the QD device are improved when the operating temperature is high. This study paves the way for developing uncooled and isolator-free PIC. 3) The limited phase noise level and optical bandwidth of the laser are the bottlenecks for further increasing the transmission capacity. To improve the transmission capacity and meet the requirement of the next generation of high-speed optical communication, we introduce the QD-based optical frequency comb (OFC) laser in this book. Benefiting from the gain broadening effect and the low-noise properties of QD, the OFC laser is realized with high optical bandwidth and low phase noise. We also provide approaches to further improve the laser performance, including the external optical feedback and the optical injection. 4) Platform with rich optical nonlinearities is highly desired by future integrated quantum technologies. In this book, we investigate the nonlinear properties and four-wave mixing (FWM) of QD laser on Si. This study reveals that the FWM efficiency of QD laser is more than ten times higher than that of quantum-well laser, which gives insight into developing a QD-based silicon platform for quantum states of light generation. Based on the results in this book, scientists, researchers, and engineers can come up with an informed judgment in utilizing the QD laser for applications ranging from classical silicon PIC to integrated quantum technologies.

Reliability of Semiconductor Lasers and Optoelectronic Devices simplifies complex concepts of optoelectronics reliability with approachable introductory chapters and a focus on real-world applications. This book provides a brief look at the fundamentals of laser diodes, introduces reliability qualification, and then presents real-world case studies discussing the principles of reliability and what occurs when these rules are broken. Then this book comprehensively looks at optoelectronics devices and the defects that cause premature failure in them and how to control those defects. Key materials and devices are reviewed including silicon photonics, vertical-cavity surface-emitting lasers (VCSELs), InGaN LEDs and lasers, and AlGaN LEDs, covering the majority of optoelectronic devices that we use in our everyday lives, powering the Internet, telecommunication, solid-state lighting, illuminators, and many other applications. This book features contributions from experts in industry and academia working in these areas and includes numerous practical examples and case studies.This book is suitable for new entrants to the field of optoelectronics working in R&D. - Includes case studies and numerous examples showing best practices and common mistakes affecting optoelectronics reliability written by experts working in the industry - Features the first wide-ranging and comprehensive overview of fiber optics reliability engineering, covering all elements of the practice from building a reliability laboratory, qualifying new products, to improving reliability on mature products - Provides a look at the reliability issues and failure mechanisms for silicon photonics, VCSELs, InGaN LEDs and lasers, AIGaN LEDs, and more