This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.

Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.

This book provides a hands-on introductory course on concepts of C programming using a PIC® microcontroller and CCS C compiler. Through a project-based approach, this book provides an easy to understand method of learning the correct and efficient practices to program a PIC® microcontroller in C language. Principles of C programming are introduced gradually, building on skill sets and knowledge. Early chapters emphasize the understanding of C language through experience and exercises, while the latter half of the book covers the PIC® microcontroller, its peripherals, and how to use those peripherals from within C in great detail. This book demonstrates the programming methodology and tools used by most professionals in embedded design, and will enable you to apply your knowledge and programming skills for any real-life application. Providing a step-by-step guide to the subject matter, this book will encourage you to alter, expand, and customize code for use in your own projects. - A complete introduction to C programming using PIC microcontrollers, with a focus on real-world applications, programming methodology and tools - Each chapter includes C code project examples, tables, graphs, charts, references, photographs, schematic diagrams, flow charts and compiler compatibility notes to channel your knowledge into real-world examples - Online materials include presentation slides, extended tests, exercises, quizzes and answers, real-world case studies, videos and weblinks

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.