The intense drive for signal integrity has been at the forefront ofrapid and new developments in CAD algorithms. Thousands ofengineers, intent on achieving the best design possible, use SPICE on a daily basis for analog simulation and general circuit analysis. But the strained demand for high data speeds, coupled with miniaturizationon an unprecedented scale, has highlighted the previously negligible effects of interconnects; effects which are not always handled appro priately by the present levels of SPICE. Signals at these higher speeds may be degraded by long interconnect lengths compared to the increasingly shorter sig nal rise times. Interconnect structures can be diverse (pins, connectors, leads, microstrips, striplines, etc. ) and present at any of the hierarchical packaging levels: integrated circuits, printed circuit boards, multi-chip modules or sys tem backplanes. Analysis of these effects in any CAD package has become a necessity. Asymptotic waveform evaluation (AWE) and other moment matching tech niques have recently proven useful in the analysis of interconnect structures and various networks containing large linear structures with nonlinear termi nations. Previously, all that was available to the designer was a full SPICE simulation or a quick but uncertain timing estimation. Moment matching, used in linear systems analysis as a method of model reduction, describes a method to extract a small set of dominant poles from a large network. The information is obtained from the Taylor series coefficients (moments) of that system.

Model order reduction (MOR) techniques reduce the complexity of VLSI designs, paving the way to higher operating speeds and smaller feature sizes. This book presents a systematic introduction to, and treatment of, the key MOR methods employed in general linear circuits, using real-world examples to illustrate the advantages and disadvantages of each algorithm. Following a review of traditional projection-based techniques, coverage progresses to more advanced MOR methods for VLSI design, including HMOR, passive truncated balanced realization (TBR) methods, efficient inductance modeling via the VPEC model, and structure-preserving MOR techniques. Where possible, numerical methods are approached from the CAD engineer's perspective, avoiding complex mathematics and allowing the reader to take on real design problems and develop more effective tools. With practical examples and over 100 illustrations, this book is suitable for researchers and graduate students of electrical and computer engineering, as well as practitioners working in the VLSI design industry.

As integrated circuit (IC) feature sizes scaled below a quarter of a micron, thereby defining the deep submicron (DSM) era, there began a gradual shift in the impact on performance due to the metal interconnections among the active circuit components. Once viewed as merely parasitics in terms of their relevance to the overall circuit behavior, the interconnect can now have a dominant impact on the IC area and performance. Beginning in the late 1980's there was significant research toward better modeling and characterization of the resistance, capacitance and ultimately the inductance of on-chip interconnect. IC Interconnect Analysis covers the state-of-the-art methods for modeling and analyzing IC interconnect based on the past fifteen years of research. This is done at a level suitable for most practitioners who work in the semiconductor and electronic design automation fields, but also includes significant depth for the research professionals who will ultimately extend this work into other areas and applications. IC Interconnect Analysis begins with an in-depth coverage of delay metrics, including the ubiquitous Elmore delay and its many variations. This is followed by an outline of moment matching methods, calculating moments efficiently, and Krylov subspace methods for model order reduction. The final two chapters describe how to interface these reduced-order models to circuit simulators and gate-level timing analyzers respectively. IC Interconnect Analysis is written for CAD tool developers, IC designers and graduate students.

This is the first comprehensive monograph that features state-of-the-art multigrid methods for enhancing the modeling versatility, numerical robustness, and computational efficiency of one of the most popular classes of numerical electromagnetic field modeling methods: the method of finite elements. The focus of the publication is the development of robust preconditioners for the iterative solution of electromagnetic field boundary value problems (BVPs) discretized by means of finite methods. Specifically, the authors set forth their own successful attempts to utilize concepts from multigrid and multilevel methods for the effective preconditioning of matrices resulting from the approximation of electromagnetic BVPs using finite methods. Following the authors' careful explanations and step-by-step instruction, readers can duplicate the authors' results and take advantage of today's state-of-the-art multigrid/multilevel preconditioners for finite element-based iterative electromagnetic field solvers. Among the highlights of coverage are: * Application of multigrid, multilevel, and hybrid multigrid/multilevel preconditioners to electromagnetic scattering and radiation problems * Broadband, robust numerical modeling of passive microwave components and circuits * Robust, finite element-based modal analysis of electromagnetic waveguides and cavities * Application of Krylov subspace-based methodologies for reduced-order macromodeling of electromagnetic devices and systems * Finite element modeling of electromagnetic waves in periodic structures The authors provide more than thirty detailed algorithms alongside pseudo-codes to assist readers with practical computer implementation. In addition, each chapter includes an applications section with helpful numerical examples that validate the authors' methodologies and demonstrate their computational efficiency and robustness. This groundbreaking book, with its coverage of an exciting new enabling computer-aided design technology, is an essential reference for computer programmers, designers, and engineers, as well as graduate students in engineering and applied physics.

The classic 1998 Artech House book, Quick Finite Elements for Electromagnetic Waves, has now been revised and expanded to bring you up-to-date with the latest developments in the Field. You find brand new discussions on finite elements in 3D, 3D resonant cavities, and 3D waveguide devices. Moreover, the second edition supplies you with MATLAB code, making this resource easier to comprehend and use for your projects in the field. This practical book and accompanying software enables you to quickly and easily work out challenging microwave engineering and high-frequency electromagnetic problems using the finite element method (FEM). Using clear, concise text and dozens of real-world application examples, the book provides a detailed description of FEM implementation, while the software provides the code and tools needed to solve the three major types of EM problems: guided propagation, scattering, and radiation. With this unique book and software set in hand, you can compute the dispersion diagram of arbitrarily shaped inhomogeneous isotropic lossless or lossy guiding structures, analyze E- and H-plane waveguide discontinuities and devices, and understand the reflection from and transmission through simple 2D and 3D inhomogeneous periodic structures. CD-ROM Included! Easy-to-use finite element software contains ready-made MATLAB and FORTRAN source code that you can use immediately to solve a wide range of microwave and EM problems. The package is fully compatible with Internet "freeware, " so you can perform advanced engineering functions without having to purchase expensive pre- and post-processing tools.

Antenna Theory and Microstrip Antennas offers a uniquely balanced analysis of antenna fundamentals and microstrip antennas. Concise and readable, it provides theoretical background, application materials, and details of recent progress. Exploring several effective design approaches, this book covers a wide scope, making it an ideal hands-on resource for professionals seeking a refresher in the fundamentals. It also provides the basic grounding in antenna essentials that is required for those new to the field. The book’s primary focus is on introducing practical techniques that will enable users to make optimal use of powerful commercial software packages and computational electromagnetics used in full wave analysis and antenna design. Going beyond particular numerical computations to teach broader concepts, the author systematically presents the all-important spectral domain approach to analyzing microstrip structures including antennas. In addition to a discussion of near-field measurement and the high-frequency method, this book also covers: Elementary linear sources, including Huygen’s planar element, and analysis and synthesis of the discrete and continuous arrays formed by these elementary sources The digital beam-forming antenna and smart antenna Cavity mode theory and related issues, including the design of irregularly shaped patches and the analysis of mutual coupling Based on much of the author’s own internationally published research, and honed by his years of teaching experience, this text is designed to bring students, engineers, and technicians up to speed as efficiently as possible. This text purposefully emphasizes principles and includes carefully selected sample problems to ease the process of understanding the often intimidating area of antenna technology. Paying close attention to this text, you will be able to confid

Issues in Electronic Circuits, Devices, and Materials: 2013 Edition is a ScholarlyEditions™ book that delivers timely, authoritative, and comprehensive information about Microwave Research. The editors have built Issues in Electronic Circuits, Devices, and Materials: 2013 Edition on the vast information databases of ScholarlyNews.™ You can expect the information about Microwave Research in this book to be deeper than what you can access anywhere else, as well as consistently reliable, authoritative, informed, and relevant. The content of Issues in Electronic Circuits, Devices, and Materials: 2013 Edition has been produced by the world’s leading scientists, engineers, analysts, research institutions, and companies. All of the content is from peer-reviewed sources, and all of it is written, assembled, and edited by the editors at ScholarlyEditions™ and available exclusively from us. You now have a source you can cite with authority, confidence, and credibility. More information is available at http://www.ScholarlyEditions.com/.