The success of future innovative technology relies upon a community with a shared vision. Here, we present an overview of the latest technological progress in the field of printed electronics for use in harsh or extreme environments. Each chapter unlocksscientific and engineering discoveries that will undoubtedly lead to progression from proof of concept to device creation. The main topics covered in this book include some of the most promising materials, methods, and the ability to integrate printed materials with commercial components to provide the basis for the next generation of electronics that are dubbed “survivable” in environments with high g‐orces, corrosion, vibration, and large temperature fluctuations. A wide variety of materials are discussed that contribute to robust hybrid electronics, including printable conductive composite inks, ceramics and ceramic matrix composites, polymer‐erived ceramics, thin metal films, elastomers, solders and epoxies, to name a few. Collectively, these materials and associated components are used to construct conductive traces, interconnects, antennas, pressure sensors, temperature sensors, power inducting devices, strain sensors and gauges, soft actuators, supercapacitors, piezo ionic elements, resistors, waveguides, filters, electrodes, batteries, various detectors, monitoring devices, transducers, and RF systems and graded dielectric, or graded index (GRIN) structures. New designs that incorporate the electronics as embedded materials into channels, slots and other methods to protect the electronics from the extreme elements of the operational environment are also envisioned to increase their survivability while remaining cognizant of the required frequency of replacement, reapplication and integration of power sources. Lastly, the ability of printer manufacturers, software providers and users to work together to build multi‐axis, multi‐material and commercial‐off‐the‐shelf (COTS) integration into user‐friendly systems will be a great advancement for the field of printed electronics. Therefore, the blueprint for manufacturing resilient hybrid electronics consists of novel designs that exploit the benefits of advances in additive manufacturing that are then efficiently paired with commercially available components to produce devices that exceed known constraints. As a primary example, metals can be deposited onto polymers in a variety of ways, including aerosol jetting, microdispensing, electroplating, sintering, vacuum deposition, supersonic beam cluster deposition, and plasma‐based techniques, to name a few. Taking these scientific discoveries and creatively combining them into robotic, multi‐material factories of the future could be one shared aim of the printed electronics community toward survivable device creation.

The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.

This book presents recent advances in the design, fabrication and implementation of flexible printed sensors. It explores a range of materials for developing the electrode and substrate parts of the sensors, on the basis of their electrical and mechanical characteristics. The sensors were processed using laser cutting and 3D printing techniques, and the sensors developed were employed in a number of healthcare, environmental and industrial applications, including: monitoring of physiological movements, respiration, salinity and nitrate measurement, and tactile sensing. The type of sensor selected for each application depended on its dimensions, robustness and sensitivity. The sensors fabricated were also embedded in an IoT-based system, allowing them to be integrated into real-time applications.

"HIGH-TEMPERATURE ELECTRONICS provides expert coverage of the applications, characteristics, design, selection, and operation of electronic devices and circuits at temperatures above the conventional limit of 125 degrees Celsius. This edited volume contains approximately 100 key reprinted papers covering a wide range of topics related to high-temperature electronics, eight invited papers, extensive references, and a comprehensive bibliography. Containing more than 200 pages of new material, it brings the reader a well-rounded review of high-temperature electronics from its beginnings decades ago through the present and beyond to possible future technologies. The scope of HIGH TEMPERATURE ELECTRONICS includes active components from standard and advanced semiconductor materials, passive components, as well as technologies for metallizations, interconnections, and the assembly and packaging of electronic components. This book will provide active researchers, technology developers, managers, materials scientists, and advanced students with a sound fundamental grounding in high-temperature electronics technology." Sponsored by: IEEE Components, Packaging, and Manufacturing Technology Society.

The transformation of vibrations into electric energy through the use of piezoelectric devices is an exciting and rapidly developing area of research with a widening range of applications constantly materialising. With Piezoelectric Energy Harvesting, world-leading researchers provide a timely and comprehensive coverage of the electromechanical modelling and applications of piezoelectric energy harvesters. They present principal modelling approaches, synthesizing fundamental material related to mechanical, aerospace, civil, electrical and materials engineering disciplines for vibration-based energy harvesting using piezoelectric transduction. Piezoelectric Energy Harvesting provides the first comprehensive treatment of distributed-parameter electromechanical modelling for piezoelectric energy harvesting with extensive case studies including experimental validations, and is the first book to address modelling of various forms of excitation in piezoelectric energy harvesting, ranging from airflow excitation to moving loads, thus ensuring its relevance to engineers in fields as disparate as aerospace engineering and civil engineering. Coverage includes: Analytical and approximate analytical distributed-parameter electromechanical models with illustrative theoretical case studies as well as extensive experimental validations Several problems of piezoelectric energy harvesting ranging from simple harmonic excitation to random vibrations Details of introducing and modelling piezoelectric coupling for various problems Modelling and exploiting nonlinear dynamics for performance enhancement, supported with experimental verifications Applications ranging from moving load excitation of slender bridges to airflow excitation of aeroelastic sections A review of standard nonlinear energy harvesting circuits with modelling aspects.

Modern printing is based on digitizing information and then representing it on a substrate, such as paper, pixel by pixel. One of the most common methods of digital printing is through inkjet printers. The process of inkjet printing is very complicated, and the ink used must meet certain chemical and physicochemical requirements including those related to storage stability; jetting performance; color management; wetting; and adhesion on substrates. Obviously, these requirements — which represent different scientific disciplines such as colloid chemistry, chemical engineering, and physics — indicate the need for an interdisciplinary book that will cover all aspects of making and utilizing inkjet inks.This book provides basic and essential information on the important parameters which determine ink performance. It covers not only the conventional use of inkjet technology on graphic applications, but also the extension of this method to print various functional materials, such as the use of conductive inks to print light-emitting diodes (LEDs) and three-dimensional structures. Thus, the book will serve a large community: industrial chemists who deal with ink formulations and synthesis of chemicals for inks; chemical engineers and physicists who deal with the rheological and flow properties of inks; and researchers in academic institutes who seek to develop novel applications based on inkjet printing of new materials.

Flexibility and stretchability of electronics are crucial for next generation electronic devices that involve skin contact sensing and therapeutic actuation. This handbook provides a complete entrée to the field, from solid-state physics to materials chemistry, processing, devices, performance, and reliability testing, and integrated systems development. This work shows how microelectronics, signal processing, and wireless communications in the same circuitry are impacting electronics, healthcare, and energy applications. Key Features: • Covers the fundamentals to device applications, including solid-state and mechanics, chemistry, materials science, characterization techniques, and fabrication; • Offers a comprehensive base of knowledge for moving forward in this field, from foundational research to technology development; • Focuses on processing, characterization, and circuits and systems integration for device applications; • Addresses the basic physical properties and mechanics, as well as the nuts and bolts of reliability and performance analysis; • Discusses various technology applications, from printed electronics to logic and memory devices, sensors, actuators, displays, and energy storage and harvesting. This handbook will serve as the one-stop knowledge base for readership who are interested in flexible and stretchable electronics.