This book describes machine learning-based new principles, methods of design and optimization of high-speed integrated circuits, included in one electronic system, which can exchange information between each other up to 128/256/512 Gbps speed. The efficiency of methods has been proven and is described on the examples of practical designs. This will enable readers to use them in similar electronic system designs. The author demonstrates newly developed principles and methods to accelerate communication between ICs, working in non-standard operating conditions, considering signal deviation compensation with linearity self-calibration. The observed circuit types also include but are not limited to mixed-signal, high performance heterogeneous integrated circuits as well as digital cores.

The International Conference on Security, Surveillance & Artificial Intelligence (ICSSAI2023) was held in West Bengal, India during December 1–2, 2023. The conference was organized by the Techno India University, one of the renowned universities in the state of West Bengal which is committed for generating, disseminating and preserving knowledge.

This book provides a thorough overview of cutting-edge research on electronics applications relevant to industry, the environment, and society at large. It covers a broad spectrum of application domains, from automotive to space and from health to security, while devoting special attention to the use of embedded devices and sensors for imaging, communication and control. The book is based on the 2022 ApplePies Conference, held in Genoa, Italy in September 2022, which brought together researchers and stakeholders to consider the most significant current trends in the field of applied electronics and to debate visions for the future. Areas addressed by the conference included information communication technology; biotechnology and biomedical imaging; space; secure, clean and efficient energy; the environment; and smart, green and integrated transport. As electronics technology continues to develop apace, constantly meeting previously unthinkable targets, further attention needs to be directed toward the electronics applications and the development of systems that facilitate human activities. This book, written by industrial and academic professionals, represents a valuable contribution in this endeavor.

TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters. A series of cases are presented, including an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, offering researchers and engineers in microelectronics a uniquely useful handbook to help solve problems in 3D heterogenous RF integration oriented Hr-Si interposer technology. - Provides a detailed demonstration of the design and process development of HR-Si (High-Resistivity Silicon) interposer technology - Presents a series of implementation case studies that detail modeling and simulation, integration, qualification and testing methods - Offers a systematic and comparative literature review of HR-Si interposer technology by topic - Offers solutions to problems with TSV (through silicon via) interposer technology, including high frequency loss and cooling problems - Gives a systematic and accessible accounting on this leading technology